# US 8,540,834 B2 · Nozzle plate holding device and method for manufacturing inkjet head

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- Number: US 8,540,834 B2
- Document ID: US8540834B2
- Status: Granted
- Kind: B2
- Application number: 13/389,331
- Filed: 2010-07-26
- Published: 2012-05-31
- Granted: 2013-09-24
- Earliest claimed: 2009-08-21
- Assignees: Konica Minolta IJ Technologies, Inc.
- Applicants: Hikaru Takamatsu
- Inventors: Hikaru Takamatsu
- Web page: https://patentgrep.com/patent/US8540834B2

## CPC

- B41J 2/162: {Manufacturing of the nozzle plates}
- B41J 2/1623: {bonding and adhesion}
- B41J 2002/14362: {Assembling elements of heads}
- Y10T 156/1002: with permanent bending or reshaping or surface deformation of self sustaining lamina
- Y10T 156/101: Prior to or during assembly with additional lamina
- B41J: TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

A nozzle plate holding device having a holding section which holds a nozzle plate arranged with a plurality of nozzles, and the nozzle plate holding device being used for bonding the nozzle plate, while the holding section holds the nozzle plate, onto a head chip arranged with a plurality of channels, wherein the holding section is configured to be capable of causing a distortion deformation of the nozzle plate in a direction that is parallel to a surface of the nozzle plate and crosses a length direction of the nozzle plate.

## Claims

### Claim 1

A manufacturing method of an ink jet head for holding a nozzle plate arranged with a plurality of nozzles by a holding device, and bonding the nozzle plate held by the holding device onto a head chip arranged with a plurality of channels such that positions of the plurality of nozzles and positions of the plurality of channels coincide with each other, the method comprising the steps of:
holding the nozzle plate with the holding device;
correcting a deformation of the nozzle plate, held by the holding device, by causing a distortion deformation of the nozzle plate in a direction that is parallel to a surface of the nozzle plate and crosses a length direction of the nozzle plate; and
bonding the nozzle plate corrected of the deformation onto the head chip.

### Claim 2

A manufacturing method of an ink jet head for holding a nozzle plate arranged with a plurality of nozzles by a holding device, and bonding the nozzle plate held by the holding device onto a head chip arranged with a plurality of channels such that positions of the plurality of nozzles and positions of the plurality of channels coincide with each other, the method comprising the steps of:
holding the nozzle plate with the holding device;
after positioning and bonding both-ends portion of the nozzle plate onto the head chip, correcting a deformation of the nozzle plate by causing a distortion deformation of the nozzle plate in a direction that is parallel to a surface of the nozzle plate and crosses a length direction of the nozzle plate; and
bonding a center part of the nozzle plate corrected of the deformation onto the head chip.

### Claim 3 (depends on 1)

The manufacturing method of an ink jet head described in claim 1, wherein the nozzle plate is bonded onto the head chip by adjusting a distortion amount of the nozzle plate, after making the distortion deformation of the nozzle plate, to be 10 μm or less.