# US 8,540,824 B2 · Substrate processing method

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 8,540,824 B2
- Document ID: US8540824B2
- Status: Granted
- Kind: B2
- Application number: 12/813,251
- Filed: 2010-06-10
- Published: 2010-09-23
- Granted: 2013-09-24
- Earliest claimed: 2005-09-25
- Assignees: Sokudo Co., Ltd.
- Applicants: Koji Kaneyama; Masashi Kanaoka; Tadashi Miyagi; Kazuhito Shigemori; Shuichi Yasuda
- Inventors: Koji Kaneyama; Masashi Kanaoka; Tadashi Miyagi; Kazuhito Shigemori; Shuichi Yasuda
- Web page: https://patentgrep.com/patent/US8540824B2

## CPC

- G03F 7/70991: {Connection with other apparatus, e.g. multiple exposure stations, particular arrangement of exposure apparatus and pre-exposure and/or post-exposure apparatus; Shared apparatus, e.g. having shared radiation source, shared mask or workpiece stage, shared base-plate; Utilities, e.g. cable, pipe or wireless arrangements for data, power, fluids or vacuum}
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/0456: {in-line arrangement}
- H10P 72/0458: {vertical arrangement}
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

The transporting process from cleaning and drying processing of a substrate in a cleaning/drying processing unit in a cleaning/drying processing group to post-exposure bake (PEB) of the substrate in a thermal processing group for post-exposure bake in a cleaning/drying processing block is described below. First, after the substrate after exposure processing is subjected to the cleaning and drying processing in the cleaning/drying processing group, a sixth central robot takes out the substrate from the cleaning/drying processing group and carries that substrate into the thermal processing group for post-exposure bake in the cleaning/drying processing block.

## Claims

### Claim 1

A method of processing a substrate in a substrate processing apparatus that is arranged adjacent to an exposure device and includes a photosensitive film formation unit, a cleaning-drying processing unit, a thermal processing unit, and a development processing unit, the method comprising the steps of:
forming a photosensitive film made of photosensitive material on an upper surface of the substrate by the photosensitive film formation unit before exposure processing by the exposure device;
transporting the substrate after the formation of the photosensitive film by the photosensitive film formation unit to the exposure device;
transporting the substrate after the exposure processing by the exposure device from the exposure device to the cleaning-drying processing unit;
rotating the substrate after the exposure processing about a vertical axis while holding the substrate substantially horizontally in the cleaning-drying processing unit;
supplying a cleaning liquid onto the photosensitive film formed on the upper surface of the substrate being rotated in the cleaning-drying processing unit;
forming a liquid layer of the cleaning liquid having an upper surface that is exposed to atmosphere and in a free state, on the photosensitive film formed on the upper surface of the substrate by adjusting a rotation speed of the substrate in the cleaning-drying processing unit, the liquid layer of the cleaning liquid being formed to cover the entire upper surface of the substrate;
stopping the supply of the cleaning liquid after forming the liquid layer of the cleaning liquid;
supplying an inert gas from a nozzle for drying processing to a center of the liquid layer on the photosensitive film on the substrate such an opening is formed at the center of the liquid layer on the photosensitive film on the substrate, and the opening is enlarged with the liquid layer maintaining an annular shape in the cleaning-drying processing unit while the upper surface of the liquid layer on the photosensitive film on the substrate is exposed to atmosphere and is in a free state, after the supply of the cleaning liquid is stopped, the opening formed in the liquid layer being enlarged by a centrifugal force without the nozzle for drying processing being moved;
removing the liquid layer on the photosensitive film on the substrate by increasing the rotation speed of the substrate after the opening formed in the liquid layer is enlarged such that the liquid layer is present only on a peripheral portion of the substrate;
transporting the substrate after the removal of the liquid layer by the cleaning- drying processing unit from the cleaning-drying processing unit to the thermal processing unit;
applying thermal processing to the substrate after the removal of the liquid layer by the thermal processing unit; and
applying development processing by the development processing unit to the substrate after the thermal processing.

### Claim 2 (depends on 1)

The substrate processing method according to claim 1 wherein:
the substrate processing apparatus further includes first and second transport devices;
the step of transporting the substrate after the exposure processing from the exposure device to the cleaning-drying processing unit comprises the step of transporting the substrate from the exposure device to the cleaning-drying processing unit by the first transport device; and
the step of transporting the substrate after the drying processing from the cleaning-drying processing unit to the thermal processing unit comprises the step of transporting the substrate from the cleaning-drying processing unit to the thermal processing unit by the second transport device.

### Claim 3 (depends on 2)

The substrate processing method according to claim 2 wherein:
the first transport device includes first and second holders that hold the substrate;
the step of transporting the substrate after the formation of the photosensitive film to the exposure device comprises the step of holding the substrate by the first holder of the first transport device and transporting the substrate to the exposure device; and
the step of transporting the substrate after the exposure processing from the exposure device to the cleaning-drying processing unit comprises the step of holding the substrate by the second holder of the first transport device and transporting the substrate from the exposure device to the cleaning-drying processing unit.

### Claim 4 (depends on 3)

The substrate processing method according to claim 3 wherein:
the step of holding and transporting the substrate from the exposure device to the cleaning-drying processing unit comprises the step of holding and transporting the substrate by the second holder that is provided below the first holder.

### Claim 5 (depends on 2)

The substrate processing method according to claim 2 wherein
the substrate processing apparatus further includes a third transport device and a first platform;
the method further comprises the step of transporting the substrate after the formation of the photosensitive film and before the exposure processing to the first platform by the third transport device; and
the step of transporting the substrate after the formation of the photosensitive film to the exposure device comprises the step of transporting the substrate from the first platform to the exposure device by the first transport device.

### Claim 6 (depends on 5)

The substrate processing method according to claim 5 further comprising the step of keeping the substrate transported by the third transport device at a temperature that is substantially equal to a temperature within the exposure device.

### Claim 7 (depends on 1)

The substrate processing method according to claim 1 wherein:
the substrate processing apparatus further includes a hydrophobic processing unit; and
the method further comprises the step of applying hydrophobic processing to the substrate after the formation of the photosensitive film and before the exposure processing.

### Claim 8 (depends on 1)

The substrate processing method according to claim 1 wherein:
the substrate processing apparatus further includes a protective film formation unit; and
the method further comprises the step of forming a protective film for protecting the photosensitive film by the protective film formation unit after the formation of the photosensitive film and before the exposure processing.

### Claim 9 (depends on 8)

The substrate processing method according to claim 8 wherein:
the substrate processing apparatus further includes a protective film removal unit; and
the method further comprises the step of removing the protective film from the substrate after the thermal processing by the thermal processing unit.

### Claim 10 (depends on 1)

The substrate processing method according to claim 1 wherein:
the substrate processing apparatus further includes an anti-reflection film formation unit; and
the method further comprises the step of forming an anti-reflection film by the anti-reflection film formation unit on the substrate before the formation of the photosensitive film.
