# US 8,540,640 B2 · Ultrasonic probe and method for manufacturing the same and ultrasonic diagnostic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,540,640 B2 - Document ID: US8540640B2 - Status: Granted - Kind: B2 - Application number: 12/525,353 - Filed: 2008-02-27 - Published: 2010-07-15 - Granted: 2013-09-24 - Earliest claimed: 2007-03-20 - Assignees: Hitachi Medical Corporation - Applicants: Shuzo Sano; Akifumi Sako; Takashi Kobayashi; Mikio Izumi - Inventors: Shuzo Sano; Akifumi Sako; Takashi Kobayashi; Mikio Izumi - Web page: https://patentgrep.com/patent/US8540640B2 ## CPC - G01N 29/2406: {Electrostatic or capacitive probes, e.g. electret or cMUT-probes} - B06B 1/0292: {Electrostatic transducers, e.g. electret-type} - G01N 29/0654: {Imaging} - G01N 29/221: {Arrangements for directing or focusing the acoustical waves (electronic orientation or focusing G01N29/262; sound directing or focusing G10K11/26; mechanical steering of sound transducers or their beams G10K11/35)} - G01N 2291/106: one or more transducer arrays - Y10T 29/49005: Acoustic transducer - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - B06B: METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, {e.g.} FOR PERFORMING MECHANICAL WORK IN GENERAL (for particular applications, see the relevant subclasses, e.g. B07B1/40, B23Q17/12, B24B31/06; measurement of mechanical vibrations G01H; in direction finding, locating, distance or velocity measuring G01S; {generating seismic energy G01V1/02}; control of mechanical vibrations in general G05D; sound-producing devices, e.g. bells, sirens, whistles G10K, {e.g. methods or devices for transmitting, conducting, or directing sound in general G10K11/00}; generation of electrical oscillations H03B; electromechanical resonators in general H03H; electromechanical transducers {for communication techniques, e.g. microphones, speakers} H04R) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An ultrasonic probe (2) comprises a cMUT chip (20), which has a plurality of vibration elements whose electromechanical coupling coefficient or the sensitivity changes depending on a bias voltage, and transmits/receives an ultrasonic wave; an acoustic lens (26) provided on the ultrasonic wave radiation side of the cMUT chip (20); a backing layer (22) provided on the back side of the cMUT chip (20) for absorbing propagation of the ultrasonic wave; an electric wiring portion (flexible substrate (72)), which is provided from the peripheral portion of the cMUT chip (20) to the side face of the backing layer (22) and has a signal pattern connected with the electrode of the cMUT chip (20) arranged thereon; and a housing (ultrasonic probe cover (25)) for containing the cMUT chip (20), the acoustic lens (26), the backing layer (22) and the electric wiring portion (flexible substrate (72)). A ground layer (conductive film (76)) of ground potential is provided on the ultrasonic wave radiation side of the cMUT chip (20). ## Claims ### Claim 1 An ultrasonic probe comprising: a Capacitive Micromachined Ultrasonic Transducer (cMUT) chip having a plurality of vibration elements whose electromechanical coupling coefficient or a sensitivity changes depending on a bias voltage, and configured to transmit/receive an ultrasonic wave; an acoustic lens provided on an ultrasonic wave radiation side of said cMUT chip; a backing layer provided on a back side of said cMUT chip, to absorb a propagation of said ultrasonic wave; an electric wiring portion provided from a peripheral portion of said cMUT chip and on a side surface of said backing layer and having a signal pattern connected with an electrode of said cMUT chip arranged thereon; and a housing for containing said cMUT chip, acoustic lens, said backing layer and said electric wiring portion, wherein: a ground layer at ground potential is bonded on the ultrasonic wave radiation side of said cMUT chip; said cMUT chip has a substrate; each of said vibration elements of said cMUT chip has a film body provided on the ultrasonic radiation side of said substrate of said cMUT chip, a lower electrode provided in said film body, and an upper electrode provided on the ultrasonic radiation side of said lower electrode; said substrate of cMUT chip is connected with a ground; AC high frequency voltage transmitting/receiving ultrasonic wave is applied on said upper electrode using ground potential as reference potential; and DC bias voltage for changing electromechanical coupling coefficient or sensitivity of said vibration element is applied on said lower electrode using ground potential as reference potential. ### Claim 2 (depends on 1) An ultrasonic probe according to claim 1, wherein said ground layer is formed along the inner surface and an outer side surface of said acoustic lens; said ground layer and a conductive member are connected and fixed on an outer side surface of said acoustic lens; and said conductive member and a ground line are connected and are fixed on an side surface of said backing layer. ### Claim 3 (depends on 1) An ultrasonic probe according to claim 1, wherein said ground layer is formed along an inner surface and an outer side surface of said acoustic lens; said ground layer is fixed and connected with a ground line on an outer side surface of said acoustic lens. ### Claim 4 (depends on 1) An ultrasonic probe according to claim 1, wherein an insulator layer is formed on at least either an ultrasonic wave radiation side or a back side, of said ground layer. ### Claim 5 (depends on 1) An ultrasonic probe according to claim 1, wherein a sealant is filled around a connecting portion between an electrode of said cMUT chip and a signal pattern of said electric wiring portion. ### Claim 6 (depends on 1) An ultrasonic probe according to claim 1, wherein an adhesive used to bond said cMUT chip and said acoustic lens is filled around a connecting portion between an electrode of said cMUT chip and a signal pattern of said electric wiring portion. ### Claim 7 (depends on 1) An ultrasonic probe according to claim 1, wherein a substrate of said cMUT chip is connected with a ground line from a side of said cMUT chip through conductive resin. ### Claim 8 (depends on 1) An ultrasonic probe according to claim 1, wherein said cMUT chip has a through hole electrically connecting an electrode of said cMUT chip to an ultrasonic wave radiation surface or a back surface; and an electrode of said cMUT chip is connected with a signal pattern of said electric wiring portion through said through hole. ### Claim 9 (depends on 8) An ultrasonic probe according to claim 8, wherein said through hole and a signal pattern of said electric wiring portion are connected by an alignment of both pad terminals. ### Claim 10 (depends on 1) An ultrasonic probe according to claim 1, wherein said cMUT chip has a through hole electrically connecting a substrate of said cMUT chip to an ultrasonic wave radiation surface or a back surface; and a substrate of said cMUT chip is connected with a ground line through said through hole. ### Claim 11 (depends on 1) An ultrasonic diagnostic device comprising: an ultrasonic probe transmitting/receiving an ultrasonic wave to a subject; an image processing part producing an ultrasonic wave image based on a received ultrasonic wave signal output from said ultrasonic probe; and a display part displaying said ultrasonic wave image, wherein said ultrasonic probe is a probe according to claim 1. ### Claim 12 An ultrasonic probe comprising: a Capacitive Micromachined Ultrasonic Transducer (cMUT) chip having a plurality of vibration elements whose electromechanical coupling coefficient or a sensitivity changes depending on a bias voltage, and configured to transmit/receive an ultrasonic wave to/from a subject; an acoustic lens provided on an ultrasonic wave radiation side of said cMUT chip; a backing layer provided on a back side of said cMUT chip, to absorb a propagation of said ultrasonic wave; an electric wiring portion provided from a peripheral portion of said cMUT chip and on a side surface of said backing layer and having a signal pattern connected with an electrode of said cMUT chip arranged thereon; and a housing for containing said cMUT chip, acoustic lens, said backing layer and said electric wiring portion, wherein: a ground layer at ground potential surrounds the ultrasonic wave radiation side of said cMUT chip and side surfaces of said cMUT chip and said electrical wiring portion, to cover said cMUT chip and said side surfaces of said electrical wiring portion as a grounding barrier to not allow electricity in the ultrasonic probe to discharge to the subject; said cMUT chip has a substrate; each of said vibration elements of said cMUT chip has a film body provided on the ultrasonic radiation side of said substrate of said cMUT chip, a lower electrode provided in said film body, and an upper electrode provided on the ultrasonic radiation side of said lower electrode; said substrate of cMUT chip is connected with a ground line; AC high frequency voltage for transmitting/receiving ultrasonic wave is applied on said upper electrode using ground potential as reference potential; and DC bias voltage for changing electromechanical coupling coefficient or sensitivity of said vibration element is applied on said lower electrode using ground potential as reference potential. ### Claim 13 (depends on 12) An ultrasonic probe according to claim 12, wherein said ground layer is formed along the inner surface and an outer side surface of said acoustic lens; said ground layer and a conductive member are connected and fixed on an outer side surface of said acoustic lens; and said conductive member and a ground line are connected and are fixed on an side surface of said backing layer. ### Claim 14 (depends on 12) An ultrasonic probe according to claim 12, wherein said ground layer is formed along an inner surface and an outer side surface of said acoustic lens; said ground layer is fixed and connected with a ground line on an outer side surface of said acoustic lens. ### Claim 15 (depends on 12) An ultrasonic probe according to claim 12, wherein an insulator layer is formed on at least either an ultrasonic wave radiation side or a back side, of said ground layer. ### Claim 16 (depends on 12) An ultrasonic probe according to claim 12, wherein a sealant is filled around a connecting portion between an electrode of said cMUT chip and a signal pattern of said electric wiring portion. ### Claim 17 (depends on 12) An ultrasonic probe according to claim 12, wherein an adhesive used to bond said cMUT chip and said acoustic lens is filled around a connecting portion between an electrode of said cMUT chip and a signal pattern of said electric wiring portion. ### Claim 18 (depends on 12) An ultrasonic probe according to claim 12, wherein a substrate of said cMUT chip is connected with a ground line from a side of said cMUT chip through conductive resin. ### Claim 19 (depends on 12) An ultrasonic probe according to claim 12, wherein said cMUT chip has a through hole electrically connecting an electrode of said cMUT chip to an ultrasonic wave radiation surface or a back surface; and an electrode of said cMUT chip is connected with a signal pattern of said electric wiring portion through said through hole. ### Claim 20 (depends on 19) An ultrasonic probe according to claim 19, wherein said through hole and a signal pattern of said electric wiring portion are connected by an alignment of both pad terminals. ### Claim 21 (depends on 12) An ultrasonic probe according to claim 12, wherein said cMUT chip has a through hole electrically connecting a substrate of said cMUT chip to an ultrasonic wave radiation surface or a back surface; and a substrate of said cMUT chip is connected with a ground line through said through hole.