# US 8,540,550 B2 · Glass substrate polishing method, package manufacturing method, piezoelectric vibrator, oscillator, electronic device and radio timepiece > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,540,550 B2 - Document ID: US8540550B2 - Status: Granted - Kind: B2 - Application number: 13/163,096 - Filed: 2011-06-17 - Published: 2011-10-13 - Granted: 2013-09-24 - Earliest claimed: 2009-02-25 - Assignees: Seiko Instruments Inc. - Applicants: Youichi Fujihira; Kazuyoshi Sugama - Inventors: Youichi Fujihira; Kazuyoshi Sugama - Web page: https://patentgrep.com/patent/US8540550B2 ## CPC - H03H 9/1021: {the BAW device being of the cantilever type} - B24B 37/08: for double side lapping - C03C 19/00: Surface treatment of glass, not in the form of fibres or filaments, by mechanical means (sand-blasting, grinding, or polishing glass B24) - Y10T 29/42: Piezoelectric device making - H03H: IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS (waveguides, resonators, lines or other devices of the waveguide type H01P) - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS - C03C: CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A glass substrate polishing method having polishing processes for polishing a glass substrate surface while supplying a polishing agent. The glass substrate polishing method is characterized in that the polishing processes include a first polishing process in which the surface of the glass substrate is polished using a first polishing pad made from a polishing cloth and a second polishing process in which the surface of the glass substrate is polished using a second polishing pad made from urethane foam. ## Claims ### Claim 1 A glass substrate polishing method including polishing processes for polishing a surface of a glass substrate while supplying a polishing agent, the glass substrate polishing method comprising: polishing the surface of the glass substrate with a first polishing process using a first polishing pad comprising a polishing cloth, and subsequently polishing the surface of the glass substrate with a second polishing process using a second polishing pad comprising urethane foam, where the second polishing pad has a higher degree of hardness than the first polishing pad. ### Claim 2 (depends on 1) The glass substrate polishing method according to claim 1, further comprising forming a recessed portion on the surface of the glass substrate, and polishing a tip end surface of a division wall, the division wall surrounding a periphery of the recessed portion. ### Claim 3 (depends on 1) The glass substrate polishing method according to claim 1, wherein the first polishing process and the second polishing process comprise using a two-sided polishing device and simultaneously polishing a rear surface of the glass substrate. ### Claim 4 (depends on 3) The glass substrate polishing method according to claim 3, wherein the two-sided polishing device comprises a planetary gear mechanism with a disc-shaped carrier that includes a retaining hole that houses the glass substrate, and a lower surface plate and an upper surface plate on upper and lower sides of the carrier respectively, and adhering one of the first polishing pad and the second polishing pad thereto, and wherein the lower surface plate and the upper surface plate are pressed against the surface and the rear surface of the glass substrate via one of the first polishing pad and the second polishing pad, and the carrier rotates about an a carrier axis while revolving around an axis line, and a rotational direction of the lower surface plate is opposite to a rotational direction of the upper surface plate. ### Claim 5 (depends on 4) The glass substrate polishing method according to claim 4, wherein in the second polishing process, the second polishing pad is on the lower surface plate and polishes the surface of the glass substrate, and a third polishing pad comprising a material that is softer than the urethane foam is on the upper surface plate and simultaneously polishes the rear surface side of the glass substrate. ### Claim 6 (depends on 1) A package manufacturing method for enclosing an electronic component in a cavity between a plurality of bonded substrates, the package manufacturing method comprising: forming a recessed portion for the cavity on a surface of a first substrate among the plurality of substrates; polishing a tip end surface of a division wall that surrounds a periphery of the recessed portion, using the glass substrate polishing method according to claim 1; and anodically bonding a second substrate among the plurality of substrates onto the tip end surface of the division wall. ### Claim 7 (depends on 6) A piezoelectric vibrator manufactured using the package manufacturing method according to claim 6. ### Claim 8 (depends on 7) An oscillator, wherein the piezoelectric vibrator according to claim 7 is electrically connected to an integrated circuit as an oscillation element. ### Claim 9 (depends on 7) An electronic device, wherein the piezoelectric vibrator according to claim 7 is electrically connected to a time measuring portion. ### Claim 10 (depends on 7) A radio timepiece, wherein the piezoelectric vibrator according to claim 7 is electrically connected to a filter portion. ### Claim 11 A glass substrate polishing method including polishing processes for polishing a surface of a glass substrate while supplying a polishing agent, the glass substrate polishing method comprising: forming a recessed portion having a division wall on the surface of the glass substrate, where the division wall surrounds a periphery of the recessed portion; and polishing a tip end surface of a division wall with a first polishing process using a first polishing pad comprising a polishing cloth, and with a second polishing process using a second polishing pad comprising urethane foam. ### Claim 12 A glass substrate polishing method including polishing processes for polishing a surface of a glass substrate while supplying a polishing agent, the glass substrate polishing method comprising: polishing the surface of the glass substrate with a first polishing process using a first polishing pad comprising a polishing cloth, and polishing the surface of the glass substrate with a second polishing process using a second polishing pad comprising urethane foam, wherein the first polishing process and the second polishing process comprise using a two-sided polishing device and simultaneously polishing a rear surface of the glass substrate.