# US 8,540,529 B2 · Shielded USB connector module with molded hood and LED light pipe > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,540,529 B2 - Document ID: US8540529B2 - Status: Granted - Kind: B2 - Application number: 13/196,379 - Filed: 2011-08-02 - Published: 2013-02-07 - Granted: 2013-09-24 - Earliest claimed: 2011-08-02 - Assignees: Conexant Systems, Inc. - Applicants: Robert W. Warren; Nic Rossi - Inventors: Robert W. Warren; Nic Rossi - Web page: https://patentgrep.com/patent/US8540529B2 ## CPC - H01R 13/6594: the shield being mounted on a PCB and connected to conductive members - H01R 13/7175: {Light emitting diodes (LEDs)} - H04R 1/1091: {Details not provided for in groups H04R1/1008 - H04R1/1083} - Y10T 29/49204: Contact or terminal manufacturing - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract There is provided a system and method for a shielded connector module with a molded hood and an LED light pipe. There is provided a shielded connector module comprising a system-in-package (SiP) device having a surface mounted light emitting diode (LED), a metallic shield surrounding the SiP device, a molded hood surrounding the metallic shield, and an LED light pipe in a proximity with the surface mounted LED, the LED light pipe being directed through the metallic shield and the molded hood. By designing the LED light pipe with a concave surface for surrounding the surface mounted LED and by using various techniques to reduce a gap between the LED and the light pipe, light capture and transmission may be optimized for easily viewable high intensity light. A fresnel lens may be optionally attached to the light pipe for wider viewing angles. ## Claims ### Claim 1 A shielded connector module comprising: a system-in-package (SIP) device having a surface mounted light emitting diode (LED) on a top surface of the SiP device; a metallic shield surrounding the SiP device and having a first hole above the top surface of the SiP device; a molded hood surrounding the metallic shield and having a second hole above the first hole; an LED light pipe in a proximity with the surface mounted LED, the LED light pipe being directed through the first hole in the metallic shield and the second hole in the molded hood. ### Claim 2 (depends on 1) The shielded connector module of claim 1, wherein the SiP device includes contacts for a Universal Serial Bus (USB) connection. ### Claim 3 (depends on 1) The shielded connector module of claim 1, wherein the molded hood comprises opaque materials. ### Claim 4 (depends on 1) The shielded connector module of claim 1, wherein the LED light pipe includes a fresnel lens on a surface thereof that is exposed outside of the molded hood. ### Claim 5 (depends on 1) The shielded connector module of claim 1, wherein the LED light pipe comprises optical grade acrylic materials. ### Claim 6 (depends on 1) The shielded connector module of claim 1, wherein the LED light pipe is secured in place by a locking shoulder. ### Claim 7 (depends on 1) The shielded connector module of claim 1, wherein the LED light pipe is secured in place by an annular ring. ### Claim 8 (depends on 1) The shielded connector module of claim 1, wherein the LED light pipe includes a concave surface surrounding the surface mounted LED. ### Claim 9 (depends on 8) The shielded connector module of claim 8, wherein the proximity of the LED light pipe to the surface mounted LED is no greater than 0.05 inches or 1.27 mm. ### Claim 10 (depends on 8) The shielded connector module of claim 8, wherein a gap between the concave surface and the surface mounted LED is filled with an optically translucent epoxy. ### Claim 11 A method of creating a shielded connector module, the method comprising: providing a system-in-package (SIP) device having a surface mounted light emitting diode (LED) on a top surface of the SiP device; surrounding the SiP device with a metallic shield having a first hole above the top surface of the SiP device; forming a molded hood around the metallic shield having a second hole above the first hole; inserting an LED light pipe in a proximity with the surface mounted LED, the LED light pipe being directed through the first hole in the metallic shield and the second hole in the molded hood. ### Claim 12 (depends on 11) The method of claim 11, further comprising, prior to the forming of the molded hood: molding the molded hood and the LED light pipe in a dual-shot molding operation. ### Claim 13 (depends on 11) The method of claim 11, wherein the SiP device includes contacts for a Universal Serial Bus (USB) connection. ### Claim 14 (depends on 11) The method of claim 11, wherein the molded hood comprises opaque materials. ### Claim 15 (depends on 11) The method of claim 11, wherein the LED light pipe includes a fresnel lens on a surface thereof that is exposed outside of the molded hood. ### Claim 16 (depends on 11) The method of claim 11, wherein the inserting of the LED light pipe is secured in place by a locking shoulder. ### Claim 17 (depends on 11) The method of claim 11, wherein the inserting of the LED light pipe is secured in place by an annular ring. ### Claim 18 (depends on 11) The method of claim 11, wherein the LED light pipe includes a concave surface surrounding the surface mounted LED. ### Claim 19 (depends on 18) The method of claim 18, wherein the proximity of the LED light pipe to the surface mounted LED is no greater than 0.05 inches or 1.27 mm. ### Claim 20 (depends on 18) The method of claim 18, wherein a gap between the concave surface and the surface mounted LED is filled with an optically translucent epoxy.