# US 8,540,422 B2 · Electrical component behavior analysis tools

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- Number: US 8,540,422 B2
- Document ID: US8540422B2
- Status: Granted
- Kind: B2
- Application number: 12/897,496
- Filed: 2010-10-04
- Published: 2012-04-05
- Granted: 2013-09-24
- Earliest claimed: 2010-10-04
- Assignees: Cameron Health, Inc.
- Applicants: Jason J. Edwardson; Timothy A. Fonte; Eric F. King; Ross G. Baker, Jr.; Toby Daniel Awender
- Inventors: Jason J. Edwardson; Timothy A. Fonte; Eric F. King; Ross G. Baker, Jr.; Toby Daniel Awender
- Web page: https://patentgrep.com/patent/US8540422B2

## CPC

- G01R 31/281: {Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing (G01R31/2818 takes precedence)}
- G01R: MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES (indicating correct tuning of resonant circuits H03J3/12)

## Abstract

Tools and methods for creating isolated or localized temperature changes on components in an electric circuit. By isolating temperature changes to individual components or small sets of components, the tools and methods allow greater control over the analysis of interactions within a board. This may allow clearer understanding of the effects of temperature on circuit component behavior. The tools and analysis advances analysis such as failure analysis and design testing.

## Claims

### Claim 1

A method of performing circuit analysis on a circuit comprising at least first and second electrical components, the method comprising:
a) providing power to at least a portion of the circuit;
b) monitoring a characteristic of operation of the circuit;
c) manipulating a temperature of a component analysis tool;
d) placing the temperature-manipulated component analysis tool relative to the first component to modify a temperature of the first component while not modifying a temperature of the second component;
e) observing whether the characteristic of operation of the circuit changes in response to temperature modification of the first component of the circuit;
f) placing the temperature-manipulated component analysis tool relative to the second component to modify a temperature of the second component while not modify a temperature of the first component;
g) observing whether the characteristic of operation of the circuit changes in response to temperature modification of the second component; and
h) comparing any observed changes in the characteristic of operation of the circuit in response to modifying the temperature of the first component to any observed changes in the characteristic of operation of the circuit and in response to modifying the temperature of the second component.

### Claim 2 (depends on 1)

The method of claim 1 wherein the circuit is disposed on a circuit board and the method further comprises pre-heating the circuit board to a desired temperature before performing at least steps b)-e).

### Claim 3 (depends on 2)

The method of claim 2 wherein the step of manipulating the temperature of the component analysis tool includes cooling the component analysis tool to a temperature below the desired temperature.

### Claim 4 (depends on 2)

The method of claim 2 wherein the step of manipulating the temperature of the component analysis tool includes heating the component analysis tool to a temperature above the desired temperature.

### Claim 5 (depends on 1)

The method of claim 1 wherein the circuit is disposed on a circuit board and the method further comprises pre-cooling the circuit board to a desired temperature before performing at least steps b)-e).

### Claim 6 (depends on 5)

The method of claim 5 wherein the step of manipulating the temperature of the component analysis tool includes cooling the component analysis tool to a temperature below the desired temperature.

### Claim 7 (depends on 5)

The method of claim 5 wherein the step of manipulating the temperature of the component analysis tool includes heating the component analysis tool to a temperature above the desired temperature.