# US 8,540,136 B1 · Methods for stud bump formation and apparatus for performing the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 8,540,136 B1 - Document ID: US8540136B1 - Status: Granted - Kind: B1 - Application number: 13/605,403 - Filed: 2012-09-06 - Granted: 2013-09-24 - Earliest claimed: 2012-09-06 - Assignees: Taiwan Semiconductor Manufacturing Company, Ltd. - Applicants: Yeong-Jyh Lin; Hsin-Hung Liao; Chien Ling Hwang; Yi-Li Hsiao; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu - Inventors: Yeong-Jyh Lin; Hsin-Hung Liao; Chien Ling Hwang; Yi-Li Hsiao; Chung-Shi Liu; Mirng-Ji Lii; Chen-Hua Yu - Web page: https://patentgrep.com/patent/US8540136B1 ## CPC - B23K 31/02: relating to soldering or welding - B21D 53/36: clips, clamps, or like fastening or attaching devices, e.g. for electric installation - B23K 20/007: {Ball bonding} - H10W 72/07141: {Means for applying energy, e.g. ovens or lasers} - Y10T 29/49: Method of mechanical manufacture - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - B21D: WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL (working or processing of wire B21F) - H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Methods for forming stud bumps and apparatuses for forming stud bumps are disclosed. According to an embodiment, a method includes clamping a wire with a clamp. The clamp includes at least two opposing plates, and at least one of the opposing plates includes a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire. The method further includes bonding the wire to a bonding surface, releasing the wire from the clamp, passing the wire a notch pitch distance through the clamp, clamping the wire with the clamp forming a second notch in the wire, and breaking the wire leaving a bonded portion of the wire on the bonding surface. The second notch is the notch pitch distance from the first notch along the wire. ## Claims ### Claim 1 A method comprising: clamping a wire with a clamp, the clamp comprising at least two opposing plates, at least one of the opposing plates comprising a protruding feature that intersects the wire when the wire is clamped forming a first notch in the wire; while the wire is clamped with the clamp, bonding the wire to a bonding surface; releasing the wire from the clamp to allow the wire to pass a notch pitch distance through the clamp; clamping the wire with the clamp forming a second notch in the wire, the second notch being the notch pitch distance from the first notch along the wire; and breaking the wire leaving a bonded portion of the wire on the bonding surface. ### Claim 2 (depends on 1) The method of claim 1, wherein the protruding feature comprises at least a portion of a semi-cylindrical shaped feature. ### Claim 3 (depends on 1) The method of claim 1, wherein the protruding feature comprises a triangular prism shaped feature. ### Claim 4 (depends on 1) The method of claim 1, wherein the protruding feature comprises a trapezoidal prism shaped feature. ### Claim 5 (depends on 1) The method of claim 1, wherein the bonded portion comprises a bump region and a tail region, the tail region comprising a segment of the wire. ### Claim 6 (depends on 1) The method of claim 1, wherein the breaking the wire comprises applying a force to the wire to break the wire at a notch proximate the bonding surface. ### Claim 7 (depends on 1) The method of claim 1 further comprising altering the notch pitch distance. ### Claim 8 A method comprising: securing a wire relative to a capillary using a clamp, the clamp comprising at least two opposing plates, at least one of the opposing plates comprising a notcher contacting the wire when the wire is secured to form a first notch in the wire; while the wire is secured using the clamp, bonding the secured wire to a bonding surface to form a bonded wire; allowing a notch pitch distance of the bonded wire to pass through the clamp; and securing the bonded wire using the clamp, the notcher contacting the bonded wire to form a second notch in the bonded wire, the second notch being the notch pitch distance from the first notch along the bonded wire. ### Claim 9 (depends on 8) The method of claim 8 further comprising breaking the bonded wire proximate a proximal notch, the proximal notch being proximate the bonding surface. ### Claim 10 (depends on 8) The method of claim 8, wherein the notcher comprises a triangular cross section, a trapezoidal cross section, or a semicircular cross section. ### Claim 11 (depends on 8) The method of claim 8, wherein the clamp further comprises a contact stopper. ### Claim 12 (depends on 8) The method of claim 8 further comprising breaking the bonded wire at a notch proximate the bonding surface, a bonded portion remaining bonded to the bonding surface, the bonded portion comprising a bump region and a tail region, the tail region comprising a segment of the wire. ### Claim 13 (depends on 8) The method of claim 8 further comprising altering the notch pitch distance. ### Claim 14 A bonder comprising: a clamp comprising: a first component comprising a first plate with a first surface; and a second component comprising a second plate with a second surface, the second surface opposing the first surface, at least one of the first surface and the second surface comprising a protruding notcher, the second component being coupled to the first component, the second component capable of articulating about a pivot on the first component to move the second surface closer to the first surface or to move the second surface further from the first surface, the first surface and the second surface being capable of clamping a wire and forming a notch in the wire using the protruding notcher when the first surface and the second surface are brought together, at least one of the first surface and the second surface comprising a contact stopper; and a bond head, the clamp being attached to the bond head. ### Claim 15 (depends on 14) The bonder of claim 14 further comprising a wire guide on the first component, the wire guide configured to guide the wire between the first surface and the second surface. ### Claim 16 (depends on 14) The bonder of claim 14 further comprising an articulation arm on the second component, the articulation arm configured to be coupled to an actuator. ### Claim 17 (depends on 14) The bonder of claim 14 further comprising a spring coupled between the first component and the second component, the spring providing a force capable of articulating the second component about the pivot to move the second surface closer to the first surface. ### Claim 18 (depends on 14) The bonder of claim 14 further comprising a bracket on the first component, the bracket being attached to the bond head. ### Claim 19 (depends on 14) The bonder of claim 14, wherein the protruding notcher has a cross section where the protruding notcher is configured to intersect the wire, the cross section being configured to be in a plane that comprises an axis of the wire, the cross section comprising a triangular cross section, a trapezoidal cross section, or a semicircular cross section.