# US 8,540,001 B2 · Die bonder and semiconductor manufacturing method

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- Number: US 8,540,001 B2
- Document ID: US8540001B2
- Status: Granted
- Kind: B2
- Application number: 13/044,148
- Filed: 2011-03-09
- Published: 2012-08-23
- Granted: 2013-09-24
- Earliest claimed: 2011-02-18
- Assignees: Hitachi High-Tech Instruments Co., Ltd.
- Applicants: Masamichi Kihara; Yoshiaki Kishi
- Inventors: Masamichi Kihara; Yoshiaki Kishi
- Web page: https://patentgrep.com/patent/US8540001B2

## CPC

- H10P 72/0446: {Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates}
- H10P 72/53: {using optical controlling means}
- H10W 72/07178: {Means for aligning}
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention provides a reliable die bonder that can accurately bond a die and a semiconductor manufacturing method. The present invention is provided with a bonding head that adsorbs a die from a wafer and bonds it to a substrate, a positioning mechanism that is provided with a first adjustment mechanism that positions a position of the die at predetermined accuracy, and positions the bonding head, a positioning controller that controls the positioning mechanism and a second adjustment mechanism that is provided to the bonding head, and adjusts a position of the die at higher accuracy than the first adjustment mechanism.

## Claims

### Claim 1

A die bonder, comprising:
a bonding head that adsorbs a die from a wafer and bonds it to a substrate;
a first adjustment mechanism that positions the bonding head in order to position a position of the die at predetermined accuracy;
a second adjustment mechanism that is provided to the bonding head, and adjusts the position of the die at higher accuracy than the first adjustment mechanism;
a positioning controller that controls the first adjustment mechanism and the second adjustment mechanism;
a reference mark provided to a substrate or in the vicinity of the substrate;
a first imaging means that images the reference mark and a recognition pattern provided to a bonding position of the substrate;
a second imaging means that images the reference mark and the die brought close to the bonding position; and
a misregistration detector provided with a correcting means that corrects a position of the die brought close to the bonding position based upon imaged data acquired by the first and second imaging means.

### Claim 2 (depends on 1)

The die bonder according to claim 1, wherein the second adjustment mechanism is provided with an actuator that acts upon a shaft at an end of the bonding head from a plurality of directions and displaces the bonding head by a predetermined quantity.

### Claim 3 (depends on 2)

The die bonder according to claim 2, wherein the actuator is one of a piezo-electric device and an ultra-magnetostrictive device.

### Claim 4 (depends on 2)

The die bonder according to claim 2, comprising a restoring force means that generates restoring force for restoring the displacement of the predetermined quantity from directions opposite to the plurality of directions.

### Claim 5 (depends on 1)

The die bonder according to claim 1, wherein the recognition pattern is provided to a predetermined position so that a center position of the recognition pattern matches the center position of the tip portion of the bonding head when the die is mounted on the substrate, and the misregistration detector obtains the center position of the recognition pattern as the origin at the center point of the reference mark from the imaging result of the first imaging means, obtains the center position of the tip portion as the origin at the center point of the reference mark from the imaging result of the second imaging means, and detects misregistration of the tip portion as the difference between the center position of the tip portion and the center position of the recognition pattern.

### Claim 6 (depends on 5)

The die bonder according to claim 5, wherein the predetermined position provided with the recognition pattern is the location of a line corresponding to a diagonal of the tip portion.

### Claim 7 (depends on 1)

The die bonder according to claim 1, wherein the tip portion is the die adsorbed to the bonding head or a collet for holding the die.

### Claim 8 (depends on 5)

The die bonder according to claim 5, wherein the tip portion is the die adsorbed to the bonding head or a collet for holding the die.

### Claim 9 (depends on 1)

The die bonder according to claim 1, wherein the reference mark is formed by a light source that can irradiate spots.

### Claim 10 (depends on 5)

The die bonder according to claim 5, wherein the reference mark is formed by a light source that can irradiate the spots.

### Claim 11 (depends on 1)

The die bonder according to claim 1, wherein the first imaging means serves in a third imaging means imaging the substrate for alignment of the substrate.

### Claim 12 (depends on 5)

The die bonder according to claim 5, wherein the first imaging means serves in a third imaging means imaging the substrate for alignment of the substrate.