# US 8,539,668 B2 · Apparatus for manufacturing temporary substrate

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- Number: US 8,539,668 B2
- Document ID: US8539668B2
- Status: Granted
- Kind: B2
- Application number: 13/115,287
- Filed: 2011-05-25
- Published: 2011-12-01
- Granted: 2013-09-24
- Earliest claimed: 2010-05-28
- Assignees: Shinko Electric Industries Co., Ltd.
- Applicants: Takeshi Okada; Kazuhiro Kobayashi
- Inventors: Takeshi Okada; Kazuhiro Kobayashi
- Web page: https://patentgrep.com/patent/US8539668B2

## CPC

- H05K 3/0097: {Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards (H05K3/0052 takes precedence)}
- B32B 38/1841: {during laying up}
- B32B 37/1009: {using vacuum and fluid pressure}
- B32B 38/0004: {Cutting, tearing or severing, e.g. bursting; Cutter details (cutting in general B26D; laminating combined with punching or perforating B32B38/04; removing all or part of the layers B32B38/10; cutting in combination with laying up and registration B32B38/185 takes precedence)}
- B32B 38/145: {Printing}
- B32B 2309/10: linear, e.g. length, distance, width
- B32B 2309/105: Thickness
- B32B 2310/0843: using laser
- B32B 2457/08: PCBs, i.e. printed circuit boards
- H05K 3/205: {using a pattern electroplated or electroformed on a metallic carrier}
- H05K 3/4682: {Manufacture of core-less build-up multilayer circuits on a temporary carrier or on a metal foil}
- H05K 2201/0355: Metal foils
- H05K 2203/0156: Temporary polymeric carrier or foil, e.g. for processing or transferring
- Y10T 29/49124: On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T 29/5313: Means to assemble electrical device
- Y10T 29/5317: Laminated device
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

An apparatus for manufacturing a temporary substrate includes a jig having a table, a holding guide for positioning constituent members of the temporary substrate, a holding unit for holding the laminated constituent members, and a heater unit for performing a temporary bonding on the laminated constituent members, and further includes a drive mechanism for moving each member constituting the jig between a standby position and an in-use position. The holding guide has a plurality of step portions formed in such a manner that peripheries of the step portions define areas corresponding to outer sizes of the respective constituent members when the holding guide is moved to the in-use position. The temporary substrate has as the constituent members, a prepreg, inner metal foils respectively stacked on both surfaces of the prepreg and each having a smaller outer size than the prepreg, and outer metal foils respectively stacked on the inner metal foils and each having a larger outer size than the prepreg.

## Claims

### Claim 1

An apparatus for manufacturing a temporary substrate, comprising:
a jig including
a table for laminating constituent members of the temporary substrate,
a holding guide for guiding one of the constituent members to a predetermined position,
a holding unit for holding the laminated constituent members, and
a heater unit for performing a temporary bonding on the laminated constituent members; and
a drive mechanism for moving each of the holding guide, the holding unit and the heater unit between a standby position and an in-use position,
wherein the holding guide has a plurality of step portions formed in such a manner that peripheries of the step portions define areas corresponding to outer sizes of the respective constituent members when the holding guide is moved to the in-use position.

### Claim 2 (depends on 1)

The apparatus for manufacturing a temporary substrate, according to claim 1, wherein the temporary substrate has, as the constituent members:
a prepreg;
inner metal foils respectively stacked on both surfaces of the prepreg and each having a smaller outer size than the prepreg; and
outer metal foils respectively stacked on the inner metal foils and each having a larger outer size than the prepreg.

### Claim 3 (depends on 2)

The apparatus for manufacturing a temporary substrate, according to claim 2, wherein the plurality of step portions provided on the holding guide include a first step portion corresponding to the outer size of the inner metal foil, a second step portion corresponding to an outer size of the prepreg, and a third step portion corresponding to the outer size of the outer metal foil.

### Claim 4 (depends on 2)

The apparatus for manufacturing a temporary substrate, according to claim 2, further comprising a plurality of positioning pins for fixing positions of the stacked outer metal foils, the positioning pins being disposed at positions near a periphery of the table, and the positioning pins being provided in such a manner as to protrude from top of the table during use.

### Claim 5 (depends on 4)

The apparatus for manufacturing a temporary substrate, according to claim 4, further comprising a plate-shaped member placed on the outer metal foil stacked as an uppermost layer before the temporary bonding is performed using the heater unit.

### Claim 6 (depends on 5)

The apparatus for manufacturing a temporary substrate, according to claim 5, wherein the plate-shaped member and the table are both formed of a material having a good thermal conductivity.