Back to results
US 8,527,084 B2Granted
Method for cutting a material layer by means of a cutting beam
AssigneeMicromachining AG
InventorWalter Maurer
Life of this patent
Estimating the term…
Abstract
In the method for cutting a material layer (20) along a given cutting line (21), a cutting beam is moved so as to impinge on the material layer (20) laterally offset by a distance (W) from the cutting line (21). The distance (W) is determined as a function of the variations of the cutting speed at which the cutting beam is moved, and/or as a function of the deviations of the effective cutting beam cross-section from a circular shape.
Claims17
A method for cutting a material layer along a predetermined cutting line by means of a cutting beam, comprising:
- while impinging the cutting beam on the material layer, moving the cutting beam at a predetermined cutting speed, the cutting beam impinging on the material layer with a lateral offset, said offset delimited by a distance from the cutting line;
- and
- during said moving, automatically adjusting the distance of the offset based on at least one of i) variations of the cutting speed, and ii) deviations of an effective cross-section of the cutting beam from a circular shape.
Dependencies are inferred from the claim text.