Component mounting method, component mounting apparatus, method for determining mounting conditions, and apparatus and program for determining mounting conditions

A mounting condition determination method of determining a mounting condition for mounting a component on a substrate, said mounting condition determination method comprising:

• determining a first mounting condition for mounting a component on a substrate that is predetermined, the mounting being repeated;
• determining a second mounting condition for determining whether the component is a first predetermined component or a second predetermined component, the first predetermined component requiring a high accuracy in the mounting and including a fine component and a component with a narrow lead pitch, and the second predetermined component requiring, before mounting the second predetermined component, confirmation of a status of a region in which the second predetermined component is to be mounted on the substrate;
• and
• determining a third mounting condition under which (i) when a determination is made that the component is the first predetermined component, a mounting status of the first predetermined component is inspected after mounting the first predetermined component, and (ii) when a determination is made that the component is the second predetermined component, the status of the region in which the second predetermined component is to be mounted on the substrate is inspected before mounting the second predetermined component to determine whether the region is acceptable for mounting the second predetermined component,
• wherein said mounting condition determination method is used by a component mounter including a mounting head to mount the component on the substrate;
• and an inspection head to inspect the substrate, and
• said mounting condition determination method further includes
• calculating a distance from a first home position to the substrate and a distance from a second home position to the substrate,
• comparing the distance from the first home position to the substrate to the distance from the second home position to the substrate, and
• arranging, based on a result of said comparing, (i) the mounting head at one of the first and second home positions which has a shorter distance to the substrate and (ii) the inspection head at one of the first and second home positions which has a longer distance to the substrate.