Electronic assembly including die on substrate with heat spreader having an open window on the die
AssigneeTexas Instruments Incorporated
InventorsSatoshi Yokoya, Margaret Rose Simmons-Matthews
Life of this patent
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Abstract
An electronic assembly includes a workpiece, a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon. The TSV die is attached to the workpiece with its topside on the workpiece. A heat spreader having an inner open window is on the bottomside of the TSV die. Bonding features are coupled to the TSV connectors or include the TSV connectors themselves. The bonding features protrude from the inner open window to a height above a height of the top of the heat spreader that allows a top die to be bonded thereto.
Claims20
An electronic assembly:
- a workpiece;
- a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon, wherein said TSV die is attached to said workpiece with said topside on said workpiece;
- a heat spreader having an inner open window on said bottomside of said TSV die, and
- bonding features coupled to said TSV connectors or including said TSV connectors, wherein said bonding features protrude from said inner open window to a height above a height of a top of said heat spreader.
An electronic assembly, comprising:
- a workpiece;
- a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon, wherein said TSV die is attached to said workpiece with said topside on said workpiece;
- a heat spreader having an inner open window on said bottomside of said TSV die, and
- an interposer including a plurality of TSVs in said open window coupled to said TSV connectors on said bottomside of said TSV die.
A method of forming an electronic assembly, comprising:
- attaching a through substrate via (TSV) die including a substrate and a plurality of TSVs, a topside and a bottomside having TSV connectors thereon with said topside down onto a workpiece, and
- attaching a heat spreader having an inner open window on said bottomside of said TSV die, wherein said bonding features coupled to said TSV connectors or including said TSV connectors protrude from said inner open window to a height above a height of a top of said heat spreader.
Dependencies are inferred from the claim text.