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US 8,526,185 B2Granted
Collar for electrically grounding a heat sink for a computer component
AssigneeCisco Technology, Inc.
InventorsEric Heidepriem, Robert Grimes
Life of this patent
Estimating the term…
Abstract
To reduce the impedance of the ground path from a heat sink to a ground pad on a printed circuit board, and thus reduce electromagnetic interference, an electrically conductive collar is arranged around an opening in the heat sink. The electrically conductive collar may include an internal extension, such that the internal extension abuts the conducting member passed through the electrically conductive collar and the opening in the heat sink to electrically ground the heat sink to the ground pad on the printed circuit board.
Claims21
An apparatus comprising:
- a heat dissipating computer component comprising a base and an opening, the opening extending through the base of the heat dissipating computer component;
- a conducting member extending through the opening of the heat dissipating computer component and being electrically grounded;
- and
- an electrically conductive collar comprising a body and an extension extending from the body, the conducting member extending through the electrically conductive collar,
- wherein the body of the electrically conductive collar abuts one of (a) a first surface of the base of the heat dissipating computer component or (b) the conducting member, and wherein the extension of the electrically conductive collar abuts the other of (a) the first surface of the base of the heat dissipating computer component or (b) the conducting member.
2 more elements
An apparatus comprising:
- a printed circuit board comprising a ground pad;
- an electrical component that generates heat when operating, the electrical component comprising a first surface and being electrically connected to the printed circuit board;
- a heat sink comprising a base, the base comprising a first surface, a second surface and an opening, the second surface of the base being in contact with the first surface of the electrical component for dissipating the heat generated by the electrical component;
- and
- an assembly for electrically grounding the heat sink, the assembly comprising:
- a conducting member extending through the opening of the heat sink and abutting the ground pad on the printed circuit board;
- and
- an electrically conductive collar comprising an internal finger extending away from the electrically conductive collar, the conducting member extending through the electrically conductive collar,
- wherein the electrically conductive collar abuts the first surface of the base of the heat sink, and
- wherein the internal finger of the electrically conductive collar abuts the conducting member.
7 more elements
A method comprising:
- positioning a conducting member in an electrically conductive collar and an opening in a heat dissipating computer component attachable to a heat generating electrical component, such that an internal extension extending inward from an inner perimeter of an annular body of the electrically conductive collar is in contact with the conducting member;
- electrically grounding the conducting member;
- and
- applying a force to a first surface of the annular body of the electrically conductive collar, such that a second surface of the annular body of the electrically conductive collar is in contact with a first surface of the heat dissipating computer component.
1 more element
Dependencies are inferred from the claim text.