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US 8,526,184 B2Granted
Devices having a thermal interface and methods of forming the same
AssigneeCurtiss-Wright Controls, Inc.
InventorsRobert C. Sullivan, Michael R. Palis, Ryan Pellecchia
Life of this patent
Estimating the term…
Abstract
A conduction-cooled enclosure comprises a card guide having a card guide channel, at least one controlled-volume cavity in the card guide channel, and a thermal interface material (TIM) in the at least one controlled-volume cavity.
Claims34
A conduction-cooled enclosure comprising:
- a first card guide and a second card guide, each having a first wall surface, a second wall surface, a sidewall between the first and second wall surfaces, and a card guide channel in a region between the first wall surface and the second wall surface, wherein the sidewall of the first card guide faces the sidewall of the second card guide, wherein the first and second wall surfaces of the first card guide face each other, wherein the first and second wall surfaces of the second card guide face each other, and wherein the first card guide and the second card guide define a card slot of the enclosure;
- at least one controlled-volume cavity, the controlled-volume cavity comprising a recess in at least one of the first wall surface and the second wall surface of at least one of the first card guide and the second card guide, the recess having exclusively one opening such that the controlled-volume cavity is sealed other than at the one opening;
- and
- a compressible thermal interface material (TIM) in the recess of at least one controlled-volume cavity.
1 more element
A card guide of a conduction-cooled enclosure constructed and arranged to accept an edge of a circuit card, wherein a dry-contact interface is between the card guide and the circuit card, the card guide including:
- a top surface;
- a bottom surface;
- a sidewall between the top surface and the bottom surface, wherein the sidewall of the card guide faces a sidewall of another card guide of the enclosure, and wherein the top and bottom surfaces of the card guide face each other;
- a card guide channel in a region between the top surface and the bottom surface, the card guide channel facing a card guide channel of the other card guide;
- a controlled-volume cavity, the controlled-volume cavity comprising a recess in at least one of the top surface and the bottom surface of the card guide, the recess having exclusively one opening such that the controlled-volume cavity is sealed other than at the one opening;
- and
- a compressible thermal interface material (TIM) in the recess of the controlled-volume cavity, wherein when the circuit card is mounted in the card guide channel, the circuit card is in thermal contact with the at least one of the top surface and the bottom surface such that a conduction cooling path is formed from the circuit card to the enclosure through the TIM.
4 more elements
Dependencies are inferred from the claim text.