Method for manufacturing array substrate and array substrate, and method for manufacturing screen and screen
AssigneeSeiko Epson Corporation
InventorsAtsushi Saito, Kazuo Aoki, Shintaro Yoshitome
Life of this patent
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Abstract
A method for manufacturing an array substrate includes forming a plurality of holes in a film shape substrate having thermal plasticity, in which the holes have a diameter of 0.25 times to 2 times a thickness of the substrate, and a pitch of 5 times to 40 times the diameter of the holes; and heating a molding member provided with a plurality of convex portions or concave portions in an array pattern, pressing the substrate provided with the plurality of holes, and transferring the plurality of convex portions or concave portions to the substrate.
Claims8
A method for manufacturing an array substrate comprising:
- forming a plurality of holes in a film-shaped substrate having thermal plasticity such that each of the holes extend completely through the substrate in a thickness direction of the substrate, in which the holes have a diameter of 0.25 times to 2 times a thickness of the substrate, and a pitch of 5 times to 40 times the diameter of the holes;
- and
- heating a molding member provided with a plurality of convex portions or concave portions in an array pattern, pressing the substrate provided with the plurality of holes, and transferring the plurality of convex portions or concave portions to the substrate.
Dependencies are inferred from the claim text.