Solid-state imaging device, method for manufacturing solid-state imaging device, and imaging apparatus
AssigneeSony Corporation
InventorsTakuji Matsumoto, Keiji Tatani, Yasushi Tateshita, Kazuichiro Itonaga
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Abstract
A solid-state imaging device includes, in a semiconductor substrate, a pixel portion provided with a photoelectric conversion portion, which photoelectrically converts incident light to obtain an electric signal and a peripheral circuit portion disposed on the periphery of the pixel portion, wherein a gate insulating film of a MOS transistor in the peripheral circuit portion is composed of a silicon oxynitride film, a gate insulating film of a MOS transistor in the pixel portion is composed of a silicon oxynitride film, and an oxide film is disposed just above the photoelectric conversion portion in the pixel portion.
Claims10
A solid-state imaging device comprising in a semiconductor substrate:
- a pixel portion with a photoelectric conversion portion that photoelectrically converts incident light to obtain an electric signal;
- and
- a peripheral circuit portion outside of a periphery of the pixel portion,
- wherein,
- the peripheral circuit portion includes one or more first MOS transistors and a first gate insulating film of each first MOS transistor,
- the pixel portion includes a transfer transistor and one or more second MOS transistors and a second gate insulating film of each second MOS transistor, and
- a film disposed above the photoelectric conversion portion and over the pixel portion, the film including at least two layers (i) abutting each other, and (ii) composed of a same material;
- wherein at least one of the at least two layers is disposed directly above the photoelectric conversion portion and abuts the second gate insulating film.
An imaging apparatus comprising:
- a light-condensing optical portion to condense incident light;
- a solid-state imaging device to receive and photoelectrically convert the light condensed with the light-condensing optical portion;
- and
- a signal processing portion to process the signal subjected to the photoelectrical conversion, wherein, the solid state imaging device includes, in a semiconductor substrate,
- (a) a pixel portion provided with a photoelectric conversion portion, which photoelectrically converts incident light to obtain an electric signal,
- (b) a peripheral circuit portion disposed outside of a periphery of the pixel portion,
- (c) one or more first MOS transistors in the peripheral circuit portion, a gate insulating film of each of the first MOS transistors,
- (d) one or more second MOS transistors in the pixel portion, a second gate insulating film of each of the second MOS transistors, and
- (e) a film disposed above the photoelectric conversion portion and over the pixel portion, the film including at least two layers (i) abutting each other, and (ii) composed of a same material, wherein at least one of the at least two layers is disposed directly above the photoelectric conversion portion and abuts the second gate insulating film.
Dependencies are inferred from the claim text.