Blister package with integrated electronic tag and method of manufacture
AssigneesThomas Ahlkvist Scharfeld, Tagsense, Inc.
InventorsTom Ahlkvist Scharfeld, Richard Fletcher
Life of this patent
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Abstract
A blister package with an integrated RFID tag is provided. The conductive lidding material is modified to serve not only to seal some contents within some formed blister film, but also to act as an RFID tag antenna. An electronic circuit is electrically connected to the lidding film antenna. Methods of manufacture which integrate with conventional blister package manufacturing processes are also provided.
Claims20
A blister package lidding layer for a blister package with integrated electronic tag wherein said blister package comprises one or more cavities, each cavity configured to contain an item, said lidding layer comprising
- a lidding film for closing the openings of said cavities, wherein said lidding film contains one or more electrically conductive regions;
- and
- an electronic circuit with two or more electrical connections to at least one of said electrically conductive regions, arranged to provide wireless electronic communication with an external RFID reader device.
A method for fabricating a blister package lidding layer for a blister package with integrated electronic tag and antenna wherein said blister package comprises one or more cavities, each cavity configured for containing an item, the method comprising:
- (a) providing a lidding film;
- (b) patterning of said lidding film to form one or more distinct electrically conductive regions, said regions arranged such that when sealed over said cavities, any of said contained items are not exposed;
- and
- (c) attaching an IC chip after step (a) to said patterned lidding film.
A method for fabricating a blister package lidding layer for a blister package with integrated electronic tag and antenna wherein said blister package comprises one or more cavities, each cavity configured for containing an item, the method comprising:
- (a) providing a first lidding film;
- (b) patterning of said lidding film to form one or more distinct electrically conductive regions, said regions arranged such that when sealed over said cavities, any of said contained items are not exposed;
- and
- (c) depositing a dielectric coating over portions of said first lidding film;
- (d) adding a second lidding film with one or more distinct electrically conductive regions over said dielectric coating and at least a portion of said first lidding film such that one edge of said first lidding film is electrically connected to said first lidding film;
- and
- (e) attaching an IC chip to said second lidding film after step (d), such that electrical contact is made between IC chip and first lidding film and between IC chip and second lidding film.
Dependencies are inferred from the claim text.