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US 8,525,614 B2Granted
Coupler
AssigneeTDK Corporation
InventorsToshiyasu Fujiwara, Takeshi Suga
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AssigneeTDK Corporation
InventorsToshiyasu Fujiwara, Takeshi Suga
Estimating the term…
According to an embodiment of the invention, a coupler has a first line that includes a coiled main line and a second line that includes a coiled secondary line arranged to oppose the main line via an insulating layer. The coupler also has a plurality of vias that connect the separate portions of the first line arranged in the different layers and connect the separate portions of the second line arranged in the different layers, and a plurality of terminals each connected to an end of the first and second lines. The vias include an extension via connected to the main line or the secondary line that extends through the insulating layer, and the extension via wires the first line and the second line to the same side of the insulating layer.
A coupler comprising:
A coupler comprising:
Dependencies are inferred from the claim text.
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From the US filing history. Foreign family members aren’t listed.
Coupling devices having more than two ports: conjugate devices, i.e. devices having at least one port decoupled from one other port
Consisting of two coupled guides, e.g. directional couplers: the guides being strip lines or microstrips
Waveguides
About 4 years 10 months of term left · ends 15 Aug 2031 (estimated)
The present application relates to and claims priority from Japanese Patent Application Nos. 2009-272227 and 2009-272231, both filed on Nov. 30, 2009, the entire disclosure of which is incorporated herein by reference.
1. Field of the Invention
The present invention relates to a directional coupler (hereinafter simply referred to as a “coupler”) that picks up part of an output signal, and particularly relates to a coupler formed by a thin-film formation process which is advantageous for achieving thinner products with smaller sizes.
FIG. 1 is an equivalent circuit diagram showing the configuration of a coupler according to an embodiment of the invention.
FIG. 2 is a vertical sectional view showing the configuration of a coupler according to an embodiment of the invention.
FIG. 3 is a horizontal sectional view of a wiring layer M1 of a coupler 1.
Embodiments of the invention will be described below with reference to the attached drawings. In the drawings, the same components are given the same reference numerals, and any repetitive description will be omitted. The positional relationship, such as top and bottom, left and right, etc., is as shown in the drawings unless otherwise specified. The dimensional ratios are not limited to those shown in the drawings. The below embodiments are just examples for describing the invention, and the invention is not limited to those embodiments. The invention can be modified in various ways without departing from the gist of the invention.
FIG. 1 is an equivalent circuit diagram showing the configuration of a coupler according to an embodiment of the invention. A coupler 1 has a first line L1 and a second line L2 which is electromagnetically coupled with the first line L1. In FIG. 1, a magnetic coupling M and capacitive couplings C1 and C2 are illustrated as the electromagnetic coupling between the first line L1 and the second line L2.
In the coupler 1, one end of the first line L1 is connected to an input terminal T11 and the other end of the first line L1 is connected to an output terminal T12. Also, one end of the second line L2 is connected to a coupling terminal T21 and the other end of the second line L2 is connected to an isolation terminal T22. The isolation terminal T22 is fixed to a grounding potential G via resistance R.