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US 8,525,396 B2Granted
Illumination source with direct die placement
AssigneeSoraa, Inc.
InventorsFrank Tin Chung Shum, Clifford Jue
Life of this patent
Estimating the term…
Abstract
An illumination source includes a heat sink with a planar inner core region and an outer core region having structures to dissipate heat from the inner core region. An LED assembly is affixed to the planar substrate and an adhesive layer between the planar substrate and the planar inner core region conducts heat from the LED assembly to the inner core region.
Claims30
An illumination source comprising:
- a heat sink having an inner core region and an outer core region, wherein the inner core region includes a planar region and the outer core region includes a plurality of fins configured to dissipate heat emanating from the inner core region, and wherein each fin comprises a trunk and at least two branches, one end of the trunk being connected to the inner core region, the other end of the trunk being connected to each of the at least two branches, and each of the at least two branches comprises at least two sub-branches;
- an LED assembly including an LED light source coupled to a planar substrate, wherein the planar substrate is disposed above the planar region, and wherein the LED assembly generates heat;
- and
- an adhesive layer disposed between the planar substrate and the planar region, the adhesive layer thermally conducting heat from the LED assembly to the inner core region.
1 more element
A method for making an illumination source comprising:
- receiving a heat sink having an inner core region and an outer core region, wherein the inner core region includes a planar region and the outer core region includes a plurality of fins which dissipate heat from the inner core region, wherein each fin comprises a trunk and at least two branches, one end of the trunk being connected to the inner core region, the other end of the trunk is connected to each of the at least two branches, and each of the at least two branches is connected to at least two sub-branches;
- receiving an LED assembly including an LED light source which generates heat;
- and
- disposing an epoxy layer between the planar substrate and the planar region, the epoxy layer thermally conducting heat from the LED assembly to the inner core region, the epoxy layer securing the LED assembly to the heat sink.
1 more element
Dependencies are inferred from the claim text.