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US 8,525,353 B2Granted
Microspring structures adapted for target device cooling
AssigneePalo Alto Research Center Incorporated
InventorsEugene M. Chow, Eric J. Shrader, John S. Paschkewitz
Life of this patent
Estimating the term…
Abstract
In a system for providing temporary or permanent connection of an integrated circuit die to a base substrate using electrical microsprings, a thermal element is provided that assists with cooling of the pad structure during use. The thermal element may be formed of the same material and my similar processes as the microsprings. The thermal element may be one or more block structures or one or more thermal microsprings. The thermal element may be provided with channels to contain and/or direct the flow of a thermal transfer fluid. Cooling of components associated with the pad structure (e.g., ICs) may be provided.
Claims20
A thermal and electrical contact structure for contacting a pad structure, comprising:
- a substrate;
- an electrical contact pad formed on said substrate;
- an electrical microspring structure formed over said substrate and comprising an anchor portion and a free portion, the anchor portion being fixed to said substrate and in electrical communication with said electrical contact pad, the free portion having a non-planar profile, the free portion being free to move relative to said substrate;
- and
- a thermal element formed of thermally conductive material, formed over said substrate, and configured such that when said thermal and electrical contact structure is positioned proximate said pad structure with said electrical microspring structure making electrical contact with an electrical contact pad of said pad structure said thermal element is in physical contact with said pad structure to permit thermal conduction between said pad structure and said thermal and electrical contact structure.
2 more elements
A thermal and electrical contact structure for contacting a pad structure, comprising:
- a substrate;
- an electrical contact pad formed on said substrate;
- a plurality of electrical microspring structures, each said electrical microspring structure formed over said substrate and comprising an anchor portion and a free portion, the anchor portion being fixed to said substrate and in electrical communication with said electrical contact pad, the free portion having a non-planar profile, the free portion being free to move relative to said substrate;
- a plurality of thermal microspring structures, each said thermal microspring structure formed over said substrate, of thermally conductive material, and comprising an anchor portion and a free portion, the anchor portion being fixed to said substrate and in thermal communication therewith, the free portion having a non-planar profile, the free portion being free to move relative to said substrate;
- said plurality of thermal microspring structures defining a plurality of thermal transfer fluid receiving channels;
- and
- said electrical and thermal microsprings configured such that when said thermal and electrical contact structure is positioned proximate said pad structure each said plurality of electrical microspring structures makes physical and electrical contact with an electrical contact pad of said pad structure and each said thermal microspring makes physical and thermal contact with said pad structure to permit thermal conduction between said pad structure and said thermal and electrical contact structure.
4 more elements
A contact and pad structure assembly, comprising:
- thermal and electrical contact structure, comprising:
- a substrate;
- an electrical contact pad formed on said substrate;
- an electrical microspring structure formed over said substrate and comprising an anchor portion and a free portion, the anchor portion being fixed to said substrate and in electrical communication with said electrical contact pad, the free portion having a non-planar profile, the free portion being free to move relative to said substrate;
- and
- a thermal element formed of thermally conductive material, formed over said substrate, and configured such that when said thermal and electrical contact structure is positioned proximate said pad structure with said electrical microspring structure making electrical contact with an electrical contact pad of said pad structure said thermal element is in physical contact with said pad structure to permit thermal conduction between said pad structure and said thermal and electrical contact structure;
- a pad structure, comprising:
- a substrate;
- a semiconductor die having an electrical contact pad;
- a thermal contact region;
- said thermal and electrical contact structure and said pad structure disposed relative to one another such that said electrical microspring structure makes physical and electrical contact with said electrical contact pad and said thermal element makes physical and thermal contact with said thermal contact region of said pad structure to permit thermal conduction between said pad structure and said thermal and electrical contact structure.
8 more elements
Dependencies are inferred from the claim text.