Short and low loop wire bonding

A semiconductor package comprising:

• a first bond pad disposed on a first upper surface;
• a second bond pad disposed on a second upper surface, the first upper surface being laterally spaced from the second upper surface;
• and
• a bonding wire having a first end and a second end, the first end of the bonding wire coupled to the first bond pad, and the second end of the bonding wire coupled to the second bond pad, the bonding wire comprising:
• a first length extending upward from the second bond pad to a first hump;
• a second length coupled to the first length at the first hump, the second length extending downward from the first hump to a kink, the kink disposed at a height above the first upper surface and the second upper surface;
• a third length coupled to the second length at the kink, the third length extending upward from the kink to a second hump;
• and
• a fourth length coupled to the third length at the second hump, the fourth length extending from the second hump to the first bond pad, wherein the fourth length comprises an upper portion and a lower portion coupled at a second kink spaced from the second hump, the upper portion coupled to the third length at the second hump and extending to the second kink, and the lower portion extending from the second kink to the first bond pad, the lower portion extending more vertically upward from the first upper surface than the upper portion, and the upper portion extending more laterally parallel to the first upper surface than the lower portion.

A method of coupling a first end of a bonding wire to a first bond pad on a first semiconductor die and a second end of the bonding wire to a second bond pad on a second semiconductor die, the method comprising:

• forming a ball bond on the second bond pad using a portion of the bonding wire;
• forming a first length of the bonding wire, the first length coupled to the ball bond and extending upward to a first hump in the bonding wire;
• forming a second length of the bonding wire coupled to the first length at the first hump, the second length extending downward from the first hump to a kink in the bonding wire, the kink disposed at a height above an upper surface of the first bond pad and an upper surface of the second bond pad;
• forming a third length of the bonding wire coupled to the second length at the kink, the third length extending upward from the kink to a second hump in the bonding wire;
• forming a fourth length of the bonding wire coupled to the third length at the second hump, the fourth length extending from the second hump to a first ball bond disposed on the first bond pad, wherein the fourth length comprises an upper portion and a lower portion coupled at a second kink spaced from the second hump, the upper portion coupled to the third length at the second hump and extending to the second kink, and the lower portion extending from the second kink to the first ball bond, the lower portion extending more vertically upward from the first bond pad than the upper portion, and the upper portion extending more laterally parallel to the first bond pad than the lower portion;
• and
• coupling the fourth length to the first ball bond.

A wire bonding method in which a wire passing through a capillary is coupled to a first bond pad and to a second bond pad, the method comprising the steps of:

• forming a ball bond on the second bond pad;
• thereafter, while paying out a length of the wire:
• raising the capillary substantially vertically upward a first distance from the ball bond;
• thereafter, moving the capillary laterally a second distance in a direction towards the first bond pad;
• thereafter, raising the capillary substantially vertically upward a third distance;
• thereafter, moving the capillary laterally and downward a fourth distance in a direction towards the first bond pad;
• thereafter, raising the capillary substantially vertically upward a fifth distance;
• thereafter, moving the capillary laterally a sixth distance in a direction away from the first bond pad;
• thereafter, moving the capillary laterally and downward a seventh distance in a direction away from the first bond pad;
• thereafter, moving the capillary laterally and upward an eighth distance in a direction towards the first bond pad;
• thereafter, raising the capillary substantially vertically upward a ninth distance;
• thereafter, moving the capillary arcuately downward in a direction towards the first bond pad;
• and
• thereafter, coupling the wire to the first bond pad.