Semiconductor device packages stacked together having a redistribution layer
AssigneeSamsung Electronics Co., Ltd.
InventorsIn-Sang Song, Kyung-Man Kim
Life of this patent
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Abstract
A semiconductor package includes a first package including a first substrate and at least one first semiconductor chip mounted on the first substrate, a redistribution wiring layer provided on the first package and including a connection pad, a bonding pad electrically connected to the connection pad and a dummy bonding pad electrically connected to the bonding pad, a second package stacked on the first package via the redistribution wiring layer and electrically connected to the connection pad of the redistribution wiring layer by a first connection member, a bonding wire electrically connecting the bonding pad to the first substrate, and a dummy bonding wire electrically connecting the dummy bonding pad to the first substrate.
Claims18
A semiconductor package, comprising:
- a first package including a first substrate and at least one semiconductor chip mounted on the first substrate;
- a redistribution wiring layer disposed above the first package and including a connection pad, a bonding pad electrically connected to the connection pad and a dummy bonding pad electrically connected to the bonding pad;
- a second package stacked on the first package via the redistribution wiring layer and electrically connected to the connection pad through a first connection member;
- a bonding wire extending from the bonding pad to a substrate pad disposed on an upper surface of the first substrate of the first package, wherein the bonding wire is connected to the substrate pad and electrically connects the bonding pad to the first substrate;
- and
- a dummy bonding wire extending from the dummy bonding pad to a dummy substrate pad disposed on the upper surface of the first substrate of the first package, wherein the dummy bonding wire is connected to the dummy substrate pad and electrically connects the dummy bonding pad to the first substrate, and wherein the dummy bonding wire is electrically connected to the bonding wire throw the dummy bonding pad and the bonding pad to provide a closed dummy circuit.
A semiconductor package, comprising:
- a first package including a first substrate and a plurality of semiconductor chips stacked on each other on the first substrate;
- a redistribution wiring layer disposed above an uppermost semiconductor chip of the plurality of semiconductor chips and including a connection pad, a bonding pad electrically connected to the connection pad and a dummy bonding pad electrically connected to the bonding pad;
- a second package stacked on the first package, the second package including a second substrate, and a connection member formed on a lower surface of the second substrate, wherein the connection member contacts and is electrically connected to the connection pad;
- a bonding wire electrically connecting the bonding pad to a substrate pad on the first substrate;
- and
- a dummy bonding wire extending from the dummy bonding pad to a dummy substrate pad disposed on the upper surface of the first substrate, wherein the dummy bonding wire is connected to the dummy substrate pad and electrically connects the dummy bonding pad to the dummy substrate pad on the first substrate, and wherein the dummy bonding wire is electrically connected to the bonding wire through the dummy bonding pad and the bonding pad to provide a closed dummy circuit.
Dependencies are inferred from the claim text.