Compliant conductive nano-particle electrical interconnect

A method of making an electrical interconnect to form an interconnect between contacts on an IC device and contact pads on a printed circuit board (PCB), the method comprising the steps of:

• forming a plurality of through holes from a first surface to a second surface of a substrate;
• imaging a resilient material in the through holes, the resilient material including openings extending from the first surface to the second surface;
• depositing a plurality of discrete, free-flowing conductive nano-particles in the openings of the resilient material, the conductive particles being substantially free of non-conductive materials;
• locating a plurality of first contact members at least partially in the through holes adjacent the first surface to electrically couple the nano-particles to the first contact members;
• locating a plurality of second contact members at least partially in the through holes adjacent the second surface to electrically couple the nano-particles to the second contact members;
• and
• pivoting at least the first contact members in the through holes relative to the substrate while the first contact members are supported by the resilient material and the nano-particles.