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US 8,525,335 B2Granted
Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
AssigneeTeramikros, Inc.
InventorsShinji Wakisaka, Takeshi Wakabayashi
Life of this patent
Estimating the term…
Abstract
A semiconductor construct includes a semiconductor substrate and connection pads provided on the semiconductor substrate. Some of the connection pads are connected to a common wiring and at least one of the remaining of the connection pads are connected to a wiring. The construct also includes a first columnar electrode provided to be connected to the common wiring and a second columnar electrode provided to be connected to a connection pad portion of the wiring.
Claims13
A semiconductor construct comprising:
- a semiconductor substrate;
- connection pads provided on the semiconductor substrate;
- an insulating film provided on the semiconductor substrate and having openings in regions corresponding to the connection pads;
- at least one common wiring provided solidly on the insulating film so as to be connected to common voltage connection pads among the connection pads via the openings of the insulating film;
- at least one wiring provided on the insulating film so as to be connected to a voltage connection pad that is not one of the common voltage connection pads among the connection pads via one of the openings of the insulating film;
- at least one first columnar electrode provided solidly on the common wiring;
- and
- at least one second columnar electrode provided on a connection pad portion for the second columnar electrode of the wiring.
5 more elements
A method of manufacturing a semiconductor construct, the method comprising:
- preparing a semiconductor substrate provided with connection pads and an insulating film having openings in regions corresponding to the connection pads;
- forming a common wiring solidly on the insulating film so as to be connected to common voltage connection pads among the connection pads via the openings of the insulating film, and forming a wiring on the insulating film so as to be connected to a voltage connection pad that is not one of the common voltage connection pads among the connection pads via one of the openings of the insulating film;
- and
- forming a first columnar electrode solidly on the common wiring, and forming a second columnar electrode on a connection pad portion for the second columnar electrode of the wiring.
1 more element
Dependencies are inferred from the claim text.