Component stacking for integrated circuit electronic package
AssigneeAtmel Corporation
InventorKen M. Lam
Life of this patent
Estimating the term…
Abstract
Component stacking for increasing packing density in integrated circuit packages. In one aspect of the invention, an integrated circuit package includes a substrate, and a plurality of discrete components connected to the substrate and approximately forming a component layer parallel to and aligned with a surface area of the substrate. An integrated circuit die is positioned adjacent to the component layer such that a face of the die is substantially parallel to the surface area of the substrate. The face of the die is aligned with at least a portion of the component layer, and terminals of the die are connected to the substrate.
Claims13
A method for forming an integrated circuit package, the method comprising:
- placing a plurality of discrete components on a substrate, the plurality of discrete components including a first discrete component and a spacer, the first discrete component and the spacer having approximately the same height in a direction perpendicular to the substrate;
- placing an integrated circuit die atop the plurality of discrete components, the integrated circuit die comprising first and second corners, wherein placing the integrated circuit die comprises positioning the first corner over the first discrete component and positioning the second corner over the spacer, thereby balancing the integrated circuit die against the first discrete component and the spacer;
- and
- bonding one or more connection wires between the integrated circuit die and the substrate.
Dependencies are inferred from the claim text.