IC package with capacitors disposed on an interposal layer
AssigneeAltera Corporation
InventorsTeik Tiong Toong, Loon Kwang Tan
Life of this patent
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Abstract
An integrated circuit (IC) package with a plurality of chip capacitors placed on a surface of a die is disclosed. The chip capacitors may be placed on top of the die with an interposal substrate layer. Placing chip capacitors on top of the die may reduce the size of the packaging substrate required. One or more wires may be used to connect the chip capacitors on the interposal layer to the packaging substrate. The IC package may include a lid and a thermal interface material (TIM) placed on top of the die. The lid may be shaped such that a protruding portion of the lid contacts the die directly through the TIM to improve heat dissipation.
Claims20
An integrated circuit (IC) package, comprising:
- a build-up substrate;
- an integrated circuit disposed on the build-up substrate;
- a substrate layer disposed over a top surface of the integrated circuit;
- and
- a plurality of capacitors disposed on the substrate layer, wherein the plurality of capacitors are connected to the build-up substrate and the substrate layer covers an entire area of the top surface of the IC.
An integrated circuit (IC) package, comprising:
- a build-up substrate;
- an integrated circuit disposed on a surface of the build-up substrate;
- a tape circuit disposed on a top surface of the IC, the tape circuit having a plurality of capacitors disposed thereon;
- and
- a lid having a protruding inter-portion, wherein a cavity is defined between the tape circuit and the lid.
An integrated circuit package, comprising:
- a build-up substrate;
- an integrated circuit connected to a top surface of the build-up substrate via a plurality of contact pads;
- an interposal layer on a top surface of the integrated circuit;
- a plurality of capacitors placed on the interposal layer;
- and
- a plurality of wires connecting the plurality of capacitors to the build-up substrate via the interposal layer.
Dependencies are inferred from the claim text.