Integrated circuit packaging system with leads and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsByung Tai Do, Arnel Senosa Trasporto, Linda Pei Ee Chua
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Abstract
A method of manufacture of an integrated circuit packaging system includes: forming a lead; forming an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead; mounting an integrated circuit over the lead, the integrated circuit having an inactive side and an active side; forming an encapsulation directly on the inactive side and the interior top side; and forming an insulation layer directly on the active side and a portion of the interior bottom side.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- forming a lead;
- forming an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead;
- mounting an integrated circuit over the lead, the integrated circuit having an inactive side and an active side;
- forming an encapsulation directly on the inactive side and the interior top side;
- and
- forming an insulation layer directly on the active side and a portion of the interior bottom side.
A method of manufacture of an integrated circuit packaging system comprising:
- forming a lead;
- forming an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead;
- mounting an integrated circuit over the lead, the integrated circuit having an inactive side and an active side;
- forming an encapsulation directly on the inactive side and the interior top side;
- and
- forming an insulation layer directly on the lead, the active side, and a portion of the interior bottom side.
An integrated circuit packaging system comprising:
- a lead;
- an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead;
- an integrated circuit over the lead, the integrated circuit having an inactive side and an active side;
- an encapsulation directly on the inactive side and the interior top side;
- and
- an insulation layer directly on the active side and a portion of the interior bottom side.
Dependencies are inferred from the claim text.