Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating package
AssigneeNEC Corporation
InventorsTakao Yamazaki, Masahiko Sano, Seiji Kurashina, Yoshimichi Sogawa
Life of this patent
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Abstract
The present invention is: a package main body section having a hollow section; and an electronic device provided in the hollow section in the package main body section, in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and in the through hole, there being provided a sealing section in which a vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole.
Claims21
An encapsulating package comprising:
- a package main body section having a hollow section;
- and
- an electronic device provided in the hollow section in the package main body section,
- in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section,
- in a vicinity of the through hole, there being provided a low-melting point section having a melting point lower than that of the package main body section, and
- in the through hole, there being provided a sealing section in which the low-melting point section in the vicinity of the through hole is partly heated and the low-melting point section is melted to thereby block the through hole,
- wherein the hollow section is vacuumed via the through hole, and the through hole is blocked in a vacuum atmosphere to thereby vacuum encapsulate the electronic device,
- wherein inside the package main body section, at a position which is contactable with a laser beam irradiated through the through hole, there is mounted a getter material capable of adsorbing gas molecules,
- wherein the electronic device is an infrared ray receiving element, and
- in a portion of the package main body section which opposes to a light receiving section of the infrared ray receiving element, there is provided an infrared ray transmitting hole and an infrared ray transmitting window material is bonded so as to block the infrared ray transmitting hole.
An encapsulating package comprising:
- a package main body section having a hollow section;
- and
- an electronic device provided in the hollow section in the package main body section,
- in the package main body section, there being formed a through hole, through which the hollow section communicates with outside of the package main body section, and
- in the through hole, there being provided a sealing section in which vicinity of the through hole is partly heated and a constituent material of the package main body section is melted to thereby block the through hole,
- wherein the hollow section is vacuumed via the through hole, and the through hole is blocked in a vacuum atmosphere to thereby vacuum encapsulate the electronic device,
- wherein inside the package main body section, at a position which is contactable with a laser beam irradiated through the through hole, there is mounted a getter material capable of adsorbing gas molecules,
- wherein the electronic device is an infrared ray receiving element, and
- in a portion of the package main body section which opposes to a light receiving section of the infrared ray receiving element, there is provided an infrared ray transmitting hole, and an infrared ray transmitting window material is bonded so as to block the infrared ray transmitting hole.
Dependencies are inferred from the claim text.