Semiconductor package having a plurality of input/output members
OwnerYong Woo Kim, Yong Suk Yooinventors
Life of this patent
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Abstract
A semiconductor package has a first substrate having a plurality of electrically conductive patterns formed thereon. A first semiconductor die is coupled to the plurality of conductive patterns. A second semiconductor die is coupled to the first semiconductor die by a die attach material. A third semiconductor die is coupled to the second semiconductor die by a die attach material. A second substrate having a plurality of electrically conductive patterns formed thereon is coupled to the third semiconductor die. A plurality of contacts is coupled to a bottom surface of the first substrate. A connector jack is coupled to the second substrate. A plurality of leads is coupled to the second semiconductor die by conductive wires.
Claims20
A semiconductor package comprising:
- a first substrate;
- a first plurality of electrically conductive patterns formed on the first substrate;
- a first semiconductor die coupled to the first plurality of conductive patterns;
- a second substrate;
- a second plurality of electrically conductive patterns formed on the second substrate;
- a second semiconductor die coupled to the second plurality of electrically conductive patterns and to the first semiconductor die by a die attach material;
- and
- a flexible circuit board for electrically connecting the first substrate to the second substrate.
A semiconductor package comprising:
- a first substrate;
- a first plurality of electrically conductive patterns formed on the first substrate;
- a first semiconductor die coupled to the first plurality of conductive patterns;
- a second substrate;
- a second plurality of electrically conductive patterns formed on the second substrate;
- a second semiconductor die coupled to the second plurality of electrically conductive patterns and to the first semiconductor die by a die attach material;
- and
- means for electrically connecting the first substrate to the second substrate.
A method of manufacturing a semiconductor package comprising:
- providing a first substrate having a first plurality of electrically conductive patterns formed on the first substrate and a second substrate having a second plurality of electrically conductive patterns formed on the second substrate, wherein the first substrate and the second substrate are electrically coupled together by a flexible substrate;
- coupling a first semiconductor die coupled to the first plurality of conductive patterns;
- coupling a second semiconductor die to the first semiconductor die by a die attach material;
- and
- bonding the first semiconductor die to the second semiconductor die.
Dependencies are inferred from the claim text.