Conductive chip disposed on lead semiconductor package
AssigneeFairchild Semiconductor Corporation
InventorsJatinder Kumar, David Chong
Life of this patent
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Abstract
In one implementation, an apparatus includes a semiconductor die, a lead, a non-conductive epoxy, and a conductive epoxy. The semiconductor die includes an upper surface and a lower surface opposite the upper surface. The lead is electrically coupled to the upper surface of the semiconductor die. The non-conductive epoxy is disposed on a first portion of the lower surface of the semiconductor die. The conductive epoxy is disposed on a second portion of the lower surface of the semiconductor die. In some implementations, a conductive wire extends from the lead to the upper surface of the semiconductor die to electrically couple the lead to the upper surface of the semiconductor die.
Claims21
An apparatus, comprising:
- a semiconductor die having an upper surface and a lower surface opposite the upper surface;
- a lead electrically coupled to the upper surface of the semiconductor die;
- a non-conductive epoxy disposed on a first portion of the lower surface of the semiconductor die;
- a conductive epoxy disposed on a second portion of the lower surface of the semiconductor die;
- and
- a housing containing at least a portion of the semiconductor die, the conductive epoxy extending from the lower surface of the semiconductor die to a location outside of the housing.
An apparatus, comprising:
- a semiconductor die including a vertical transistor device having an upper surface and a lower surface opposite the upper surface;
- a lead having an upper surface being electrically coupled to the upper surface of the semiconductor die;
- a non-conductive epoxy disposed on a first portion of the lower surface of the semiconductor die;
- and
- a conductive epoxy disposed on a second portion of the lower surface of the semiconductor die, the conductive epoxy having a bottom surface exposed through the non-conductive epoxy.
An apparatus, comprising:
- a semiconductor die having an upper surface and a lower surface opposite the upper surface, the lower surface having a first area surrounded by a second area of the lower surface;
- a lead electrically coupled to the upper surface of the semiconductor die;
- a non-conductive material disposed on the first area of the lower surface;
- and
- a conductive material disposed on the second area, the conductive material has a bottom surface exposed outside of the non-conductive material.
Dependencies are inferred from the claim text.