Area array quad flat no-lead (QFN) package

A microelectronic assembly, comprising:

• a lead frame including a first unit and a second unit overlying the first unit and assembled therewith through an intermediate assembly disposed between the first and second units,
• the first unit having a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom, the first unit having a first encapsulation supporting at least portions of the first conductive elements, the terminals exposed at a surface of the first encapsulant and configured for connection with a component external to the microelectronic assembly,
• the second unit having a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom, the second unit having a second encapsulation supporting at least portions of the second conductive elements,
• the intermediate assembly having at least one intermediate metal layer comprising a portion of the thickness of the lead frame and including intermediate conductive elements, the intermediate assembly having an intermediate encapsulation supporting at least portions of the intermediate conductive elements,
• at least some of the second conductive elements overlying portions of corresponding ones of the intermediate conductive elements and being joined thereto,
• at least some of the intermediate conductive elements overlying portions of corresponding ones of the first conductive elements and being joined thereto;
• and
• a microelectronic element having contacts electrically connected with the bond pads of the lead frame, the microelectronic element overlying a die attachment pad portion of the second metal layer, the die attachment pad portion overlying at least some of the terminals, the die attachment pad portions being electrically insulated from the terminals by the first, second, and intermediate encapsulations.

A microelectronic assembly, comprising:

• a lead frame including a first unit and a second unit overlying the first unit and assembled therewith,
• the first unit having a first metal layer comprising a portion of the thickness of the lead frame and including terminals and first conductive elements extending away therefrom, the first unit having a first encapsulation supporting at least portions of the first conductive elements, the terminals exposed at a bottom surface of the first encapsulant and configured for connection with a component external to the microelectronic assembly,
• the second unit having a second metal layer comprising a portion of the thickness of the lead frame and including bond pads and second conductive elements extending away therefrom, the second unit having a second encapsulation supporting at least portions of the second conductive elements,
• at least some of the second conductive elements overlying portions of corresponding ones of the first conductive elements and being joined thereto;
• and
• a microelectronic element having contacts electrically connected with at least some of the bond pads of the lead frame,
• wherein at least some of the terminals are electrically connected with corresponding ones of the bond pads and are displaced therefrom in a first horizontal direction and a second horizontal direction transverse to the first horizontal direction, the first and second horizontal directions being in a horizontal plane parallel to a face of the microelectronic element, the at least some of the terminals being completely displaced in each of the first and second horizontal direction from the corresponding ones of the bond pads.