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US 8,525,310 B2Granted
Leadframe package for high-speed data rate applications
AssigneeMediatek Inc.
InventorsNan-Jang Chen, Chun-Wei Chang, Sheng-Ming Chang, Che-Yuan Jao, Ching-Chih Li, Nan-Cheng Chen
Life of this patent
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Abstract
A semiconductor package includes a die pad; a semiconductor die mounted on the die pad; a plurality of leads disposed along peripheral edges of the die pad; a ground bar between the leads and the die pad; and a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent bridges has a length that is equal to or less than 3 mm.
Claims11
A semiconductor package, comprising:
- a die pad;
- a semiconductor die mounted on the die pad;
- a plurality of leads disposed along peripheral edges of the die pad;
- a ground bar between the leads and the die pad;
- a plurality of bridges connecting the ground bar with the die pad, wherein a gap between two adjacent said bridges has a length that is equal to or less than 3 mm;
- a plurality of first bond wires extending between the semiconductor die and the leads;
- a plurality of second bond wires extending between the semiconductor die and the ground bar;
- and
- a molding compound at least partially encapsulating the die pad, inner ends of the leads such that bottom surface of the die pad is exposed within the molding compound.
6 more elements
A semiconductor package, comprising:
- a die pad;
- a semiconductor die mounted on the die pad;
- a plurality of leads disposed along peripheral edges of the die pad;
- at least two adjacent connecting bars extending outward from respective two adjacent corners of the die pad;
- at least one ground bar between the at least two adjacent connecting bars;
- a sidewall connecting the ground bar with the die pad between the at least two adjacent connecting bars, wherein the sidewall has a length that is substantially equal to a length of the ground bar;
- a plurality of first bond wires extending between the semiconductor die and the leads;
- a plurality of second bond wires extending between the semiconductor die and the ground bar;
- and
- a molding compound at least partially encapsulating the die pad, inner ends of the leads such that bottom surface of the die pad is exposed within the molding compound.
7 more elements
Dependencies are inferred from the claim text.