Semiconductor device, lead frame assembly, and method for fabricating the same
AssigneePanasonic Corporation
InventorsKenichi Ito, Shigehisa Oonakahara, Yoshikazu Tamura, Kiyoshi Fujihara
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
Claims13
A semiconductor device comprising:
- a lead frame;
- a semiconductor element mounted on the lead frame;
- and
- a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame,
- wherein the frame-like member has at least one concave portion in a side surface thereof, which does not contact the lead frame, and
- the concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
A method for fabricating a semiconductor device, comprising the steps of:
- (a) forming an opening in a substrate at a predetermined position to form a rail, a lead frame, a tie bar attaching the lead frame to the rail, and a holding lead protruding from the rail toward the lead frame and separated from the lead frame, said holding lead having a tip portion;
- (b) after step (a), forming a frame-like member which is provided on an outer edge portion of the lead frame and in which the tip portion of the holding lead is buried, to form a pre-molding lead frame including the lead frame and the frame-like member;
- (c) after step (b), cutting the tie bar;
- and
- (d) after step (c), pulling the tip portion of the holding lead out of the frame-like member to remove the pre-molding lead frame from the rail,
- wherein in step (a), the tip portion of the holding lead is caused to be thinner than the lead frame, and
- in step (b), the frame-like member is formed to expose a bottom surface of the lead frame and cover an upper, a side, and a lower surface of the tip portion of the holding lead, and has at least one concave portion in a side surface which does not contact the lead frame.
Dependencies are inferred from the claim text.