Lead carrier with print-formed package components

A lead carrier and semiconductor, comprising in combination:

• at least one die attach pad formed of electrically conductive material;
• said die attach pad having a top side opposite a bottom side with edges between said top side and said bottom side;
• at least one terminal pad formed of electrically conductive material and spaced from said die attach pad;
• said terminal pad having an upper side opposite a lower side, with edges between said upper side and said lower side;
• said die attach pad and said terminal pad each being a sintered structure of electrically conductive material;
• a semiconductor upon said top side of said die attach pad;
• at least one wire bond between said terminal pad and said semiconductor;
• said die attach pad, said terminal pad, said semiconductor and said wire bond at least partially encapsulated within a substantially electrically non-conductive material;
• and
• at least one of said die attach pad and said plurality of terminal pads having a contoured edge which is at least partially contoured to hold said pad to said substantially electrically non-conductive material.

A lead carrier for supporting an electronic device having a plurality of inputs and/or outputs, the lead carrier comprising in combination:

• a plurality of electrically conductive pads spaced from each other;
• said pads formed of a sintered electrically conductive material;
• and
• said pads located upon a temporary layer with a melting point greater than a sintering temperature of said material forming said pads.