Back to results
US 8,525,294 B2Granted
Semiconductor device
AssigneeRenesas Electronics Corporation
InventorsAkira Tada, Hiroki Tanabe, Yoshinori Okada, Ikuo Kudo
Life of this patent
Estimating the term…
Abstract
A package-on-package includes a semiconductor package, and a coil provided at the semiconductor package. The semiconductor package includes a bottom face, and a solder ball protruded from the bottom face. An axis of the coil is inclined with respect to the normal line of the bottom face.
Claims7
A semiconductor device comprising:
- a semiconductor package including a main plane and a connection electrode protruding from said main plane, and
- a coil having at least a portion provided at said semiconductor package,
- said coil having an axis inclined with respect to a normal line of said main plane,
- wherein said coil is configured to be directly connected to a wiring of a substrate where said semiconductor package is mounted, and to be electrically connected to a coil of another semiconductor device through said wiring.
1 more element
Dependencies are inferred from the claim text.