Semiconductor device with groove structure to prevent molding resin overflow over a light receiving region of a photodiode during manufacture

A semiconductor device comprising a substrate including a plurality of semiconductor elements, at least one of which includes:

• (a) a photodiode having a light receiving region, (b) an interconnection wiring layer around the light receiving region, and (c) electrode pads on an upper surface of the interconnection wiring layer;
• an organic layer on the upper surface of the interconnection wiring layer, the organic layer not covering the light receiving region of the photodiode and not covering the electrode pads, the organic layer including (i) a groove continuously surrounding the light receiving region and (ii) portions that expose the electrode pads, the organic layer being disposed around the electrode pads;
• and
• a molding resin portion over the substrate with the organic layer thereon so that the molding resin portion does not cover the light receiving region.