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US 8,525,275 B2Granted
Methods of forming non-volatile memory devices
AssigneeSamsung Electronics Co., Ltd.
InventorsJin-Hwa Heo, Chul-Sung Kim, Bon-Young Koo, Ki-Hyun Hwang, Chang-Hyun Lee
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Abstract
A non-volatile memory device includes a dielectric layer between a charge storage layer and a substrate. Free bonds of the dielectric layer can be reduced to reduce/prevent charges from leaking through the free bonds and/or from being trapped by the free bonds. As a result, data retention properties and/or durability of a non-volatile memory device may be enhanced.
Claims3
A method of forming a non-volatile memory device, the method comprising:
- forming a dielectric layer including an oxide layer and a nitride layer on a substrate;
- transforming at least a portion of the nitride layer extending across at least a major lateral extent of the dielectric layer to include added oxygen;
- forming a charge storage layer on the dielectric layer;
- forming a blocking insulating layer on the charge storage layer;
- and
- forming a gate electrode on the blocking insulating layer,
- wherein the transforming at least a portion of the nitride layer comprises oxidizing the nitride layer,
- wherein the nitride layer is fully oxidized,
- wherein an interface of the substrate and the oxide layer includes a first nitrogen accumulation region, and an interface of the oxide layer and the oxidized nitride layer includes a second nitrogen accumulation region having a lower nitrogen concentration than the first nitrogen accumulation region, and
- wherein the at least one insulating layer of the blocking insulating layer has a higher dielectric constant than a highest dielectric constant of at least a major portion of the dielectric layer.
7 more elements
Dependencies are inferred from the claim text.