Programmable high-k/metal gate memory device
AssigneeInternational Business Machines Corporation
InventorsRoger A. Booth, Kangguo Cheng, Chandrasekharan Kothandaraman, Chengwen Pei
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AssigneeInternational Business Machines Corporation
InventorsRoger A. Booth, Kangguo Cheng, Chandrasekharan Kothandaraman, Chengwen Pei
Estimating the term…
A method of fabricating a memory device is provided that may begin with forming a layered gate stack overlying a semiconductor substrate and patterning a metal electrode layer stopping on the high-k gate dielectric layer of the layered gate stack to provide a first metal gate electrode and a second metal gate electrode on the semiconductor substrate. In a next process sequence, at least one spacer is formed on the first metal gate electrode overlying a portion of the high-k gate dielectric layer, wherein a remaining portion of the high-k gate dielectric is exposed. The remaining portion of the high-k gate dielectric layer is etched to provide a first high-k gate dielectric having a portion that extends beyond a sidewall of the first metal gate electrode and a second high-k gate dielectric having an edge that is aligned to a sidewall of the second metal gate electrode.
A memory device comprising:
Dependencies are inferred from the claim text.