Power semiconductor structure with schottky diode
AssigneeGreat Power Semiconductor Corp.
InventorsHsiu Wen Hsu, Chun Ying Yeh
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Abstract
A power semiconductor structure with schottky diode is provided. In the step of forming the gate structure, a separated first polysilicon structure is also formed on the silicon substrate. Then, the silicon substrate is implanted with dopants by using the first polysilicon structure as a mask to form a body and a source region. Afterward, a dielectric layer is deposited on the silicon substrate and an open penetrating the dielectric layer and the first polysilicon structure is formed so as to expose the source region and the drain region below the body. The depth of the open is smaller than the greatest depth of the body. Then, a metal layer is filled into the open to electrically connect to the source region and the drain region.
Claims5
A power semiconductor structure with schottky diode comprising:
- a silicon substrate;
- at least a polysilicon gate structure and a first polysilicon structure, located on the silicon substrate and separated by a predetermined distance, wherein the polysilicon gate structure is located in a gate trench on the silicon substrate, and the first polysilicon structure is located on an upper surface of the silicon substrate;
- at least a body, located in the silicon substrate between the polysilicon gate structure and the first polysilicon structure and partially shielded by the first polysilicon structure;
- at least a source region, located in the body and partially shielded by the first polysilicon structure;
- a dielectric layer, covering the polysilicon gate structure and the first polysilicon structure, and having an open extending downward to the silicon substrate below the body, wherein the source region is adjacent to the open and a depth of the open is smaller than a greatest depth of the body;
- and
- a metal layer, filled in the open.
Dependencies are inferred from the claim text.