Light-emitting diode integration scheme
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsDing-Yuan Chen, Wen-Chih Chiou, Chen-Hua Yu
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Abstract
A circuit structure includes a carrier substrate, which includes a first through-via and a second through-via. Each of the first through-via and the second through-via extends from a first surface of the carrier substrate to a second surface of the carrier substrate opposite the first surface. The circuit structure further includes a light-emitting diode (LED) chip bonded onto the first surface of the carrier substrate. The LED chip includes a first electrode and a second electrode connected to the first through-via and the second through-via, respectively.
Claims20
A circuit structure comprising:
- a carrier substrate comprising:
- a first and a second through-via, wherein each of the first and the second through-vias extends from a first surface of the carrier substrate to a second surface of the carrier substrate opposite the first surface;
- a first and a second contact pad on the first surface of the carrier substrate;
- and
- a third and a fourth contact pad on the second surface of the carrier substrate, wherein the third contact pad is electrically connected to the first contact pad through the first through-via, and the fourth contact pad is electrically connected to the second contact pad through the second through-via;
- a light-emitting diode (LED) chip bonded onto the first surface of the carrier substrate, wherein the LED chip comprises a first electrode and a second electrode connected to the first contact pad and the second contact pad, respectively;
- and
- electrical connections on the second surface of the carrier substrate and connecting the first and second through-vias to a power source, wherein the first and second through-vias are connected to the power source through an additional LED chip bonded onto the first surface of the carrier substrate.
A circuit structure comprising:
- a carrier substrate comprising:
- a first through-via;
- and
- a second through-via, wherein each of the first through-via and the second through-via extends from a first surface of the carrier substrate to a second surface of the carrier substrate opposite the first surface;
- a first light-emitting diode (LED) chip bonded onto the first surface of the carrier substrate, wherein the first LED chip comprises a first electrode and a second electrode connected to the first through-via and the second through-via, respectively, and wherein a surface of the first LED chip not bonded to the carrier substrate includes a plurality of columns;
- and
- electrical connections on the second surface of the carrier substrate, wherein the electrical connections connect the first and second through-vias to a circuit comprising other electronic devices, and wherein the electrical connections are conductive traces on the second surface of the carrier substrate.
A circuit structure comprising:
- a carrier substrate comprising:
- a plurality of contact pads on a first surface of the carrier substrate;
- a plurality of contact pads on a second surface of the carrier substrate opposite the first surface;
- a plurality of through-vias extending from the first surface to the second surface of the carrier substrate, wherein each of the plurality of contact pads on the first surface of the carrier substrate is connected by one of the through-vias to one of the plurality of contact pads on the second surface of the carrier substrate;
- a plurality of LED chips bonded onto the first surface of the carrier substrate, wherein each of the plurality of LED chips comprises a first electrode and a second electrode, each electrode being connected to one of the plurality of contact pads on the first surface of the carrier substrate;
- and
- a conductive trace on a side of the second surface of the carrier substrate, wherein the conductive trace interconnects two of the plurality of contact pads on the second surface of the carrier substrate.
Dependencies are inferred from the claim text.