LED package, method for manufacturing LED package, and packing member for LED package

A packing member housing an LED package, comprising:

• a carrier member, a recessed portion to locate the LED package being formed in the carrier member, first unevenness being formed on at least a portion of a side surface of the recessed portion;
• and
• a cover member for covering the recessed portion, second unevenness being formed on a lower surface of the cover member,
• the LED package having:
• first and second lead frames apart from each other;
• an LED chip provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame;
• and a resin body covering the first and second lead frames and the LED chip, and having an upper surface with a surface roughness of 0.15 μm or higher,
• the second unevenness of the cover member being greater than the surface roughness of the upper surface of the resin body.