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US 8,525,192 B2Granted
Die package including substrate with molded device
AssigneeFairchild Semiconductor Corporation
InventorsYong Liu, Zhongfa Yuan
Life of this patent
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Abstract
A package is disclosed. The package includes a premolded substrate having a leadframe structure, a first device attached to the leadframe structure, and a molding material covering at least part of the leadframe structure and the first device. It also includes a second device attached to the premolded substrate.
Claims19
A die package comprising:
- a premolded substrate comprising
- a leadframe structure having at least two die attach pads disposed in a common plane,
- a first device attached to one of the at least two die attach pads of the leadframe structure, and
- a first molding material covering at least part of the leadframe structure and the first device;
- a second device attached to the other of the at least two die attach pads of the premolded substrate, and
- a second molding material covering the second device,
- wherein a portion of the second molding material and a portion of the first molding material abut one another at a discernible planar interface that is disposed between the first and second molding materials.
4 more elements
A method comprising:
- forming a premolded substrate comprising a leadframe structure having at least two die attach pads disposed in a common plane, a first device attached to one of the at least two die attach pads of the leadframe structure, and a first molding material covering at least part of the leadframe structure and the first device;
- attaching a second device to the other of the at least two die attach pads of the premolded substrate;
- and
- forming a second molding material that covers the second device such that a portion of the second molding material and a portion of the first molding material abut one another at a discernible planar interface that is disposed between the first and second molding materials.
1 more element
Dependencies are inferred from the claim text.