Laser soldering apparatus
AssigneePanasonic Corporation
InventorsIzuru Nakai, Masahiro Mori, Yukio Nishikawa
Life of this patent
Estimating the term…
Abstract
By irradiating laser light 20 obliquely onto a substrate 6, the laser soldering apparatus reduces the laser light passing through an insertion hole 61a in the substrate 6 and prevents damage to low-heat-resistance portions of a component 62 disposed on the rear surface side of the substrate 6. Moreover, the substrate 6 can be observed from a normal direction with a camera 23. Therefore, even if the insertion hole 61 for inserting a component lead or the like is provided in the substrate 6, the laser light does not leak out to the side of a component mounting surface 17 of the substrate 6.
Claims8
A laser soldering apparatus for soldering a component onto a soldering point on a substrate using laser light, comprising:
- a first mirror for reflecting the laser light emitted from a mirror tube in a direction intersecting with a central axis of the mirror tube;
- a second mirror for receiving the laser light from the first mirror and reflecting the laser light to a soldering point;
- an optics system for condensing the laser light, the optics system being disposed between the first mirror and the second mirror;
- and
- a camera for observing the soldering point on the substrate, disposed on the central axis of the mirror tube,
- wherein the apparatus is configured such that the laser light is irradiated from the second mirror onto the soldering point at an angle with respect to an axial direction of the mirror tube, and
- the first mirror reflects the laser light from the mirror tube and transmits the light from the soldering point to the camera.
Dependencies are inferred from the claim text.