Printed substrate through which very strong currents can pass and corresponding production method
AssigneeAEG Power Solutions B.V., Dutch Company
InventorChristian Delay
Life of this patent
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Abstract
On a printed circuit or substrate board (10) designed to receive electronic components and having conductive tracks (12) printed on said board, one or more conductive bars (18) are provided that are mounted one after another between conductive link surfaces (140, 142, 144), the conductive bars (18) being electrically interconnected during a subsequent soldering process that is either a wave soldering process or a soldering process in a reflow oven.
Claims12
A printed substrate designed to receive electronic components and having conductive tracks (12) printed on said substrate (10), said printed substrate comprising:
- a plurality of conductive link surfaces (140, 142, 144) printed directly on said substrate with spacing therebetween;
- a plurality of conductive bars (18) respectively electrically interconnecting adjacent conductive link surfaces, the bars being mounted one after another and respectively extending across the spacing, adjacent conductive bars having a gap therebetween;
- and
- solder portions filling each said gap and respectively interconnecting portions of adjacent bars, the portions lying on a common conductive link surface,
- wherein the conductive bars and the solder portions together form a continuous conductive rail;
- and
- wherein said conductive bars are held on the substrate by spots of adhesive.
A method of producing a printed substrate making it possible to pass very high currents on a conductive surface of said substrate (10), said method comprising the following steps:
- printing a plurality of conductive link surfaces (140, 142, 144) that are spaced apart directly on the substrate;
- providing a plurality of conductive bars (18) that respectively extend across the space between the conductive link surfaces to electrically interconnect the conductive link surfaces, the bars being mounted one after another, and adjacent conductive bars having a gap therebetween;
- adhering the conductive bars to the substrate using spots of adhesive;
- providing solder portions in each gap to electrically interconnect adjacent portions of conductive bars, the portions of adjacent conductive bars that are electrically interconnected lying on a common conductive link surface, wherein the conductive bars and the solder portions together form a continuous conductive rail.
Dependencies are inferred from the claim text.