Multilayer wiring board and method for manufacturing the same

A wiring board comprising:

• a substrate having an opening;
• a conductive pattern formed over the substrate, the conductive pattern comprising a first wiring layer formed directly on a surface of the substrate and a second wiring layer formed over the first wiring layer;
• and
• an electronic component positioned inside the opening of the substrate and having an electrode on at least one surface of the electronic component,
• wherein the first wiring layer has a penetrating hole formed therein such that the penetrating hole penetrates the first wiring layer and reaches the electrode of the electronic component, a via hole is formed as part of the penetrating hole and positioned inside the opening of the substrate, the second wiring layer is extended along a surface of the via hole such that a conductor is formed on the surface of the via hole, the electrode is connected to the conductive pattern through the conductor which is in contact with the electrode, and the electrode on the surface of the electronic component has a thickness less than a thickness of the conductive pattern connected to the electrode through the conductor of the via hole.