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US 8,525,040 B2Granted
Circuit board and its wire bonding structure
AssigneeKYOCERA Corporation
InventorShigeo Aono
Life of this patent
Estimating the term…
Abstract
The invention relates to a circuit board, and an image forming apparatus, a thermal head and an image sensor that employ the circuit board. A circuit board includes a substrate, a conductor which is situated on the substrate and has a groove formed on its surface, and a wire connected to the conductor. The groove surrounds a connection area between the wire and the conductor, excluding a part of the connection area defining an opening (X).
Claims3
A circuit board comprising;
- a substrate;
- a conductor which is situated on the substrate and has a groove formed on its surface;
- a wire connected to the conductor;
- and
- a base portion which is situated on the substrate and has a top surface and a lateral surface,
- the groove being configured to surround a connection area between the wire and the conductor, excluding a part of the connection area defining an opening,
- the conductor including a pad part situated on the top surface and a lateral wiring part which is electrically connected to the pad part and lies on the lateral surface, and
- the opening being situated in a boundary area of the pad part and the lateral wiring part.
5 more elements
Dependencies are inferred from the claim text.