Flex-rigid wiring board and method of manufacturing the same
AssigneeIbiden Co., Ltd.
InventorsMichimasa Takahashi, Masakazu Aoyama
Life of this patent
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Abstract
A flex-rigid wiring board includes a flexible board including a flexible substrate and a conductor pattern formed over the flexible substrate, a non-flexible substrate disposed adjacent to the flexible board, an insulating layer including an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board, a conductor pattern formed on the insulating layer, and a plating layer connecting the conductor pattern of the flexible board and the conductor pattern on the insulating layer.
Claims14
A flex-rigid wiring board comprising:
- a flexible board comprising a flexible substrate and a conductive layer formed over the flexible substrate, the conductive layer having a conductor pattern and a plurality of connection portions connected to the conductor pattern;
- a non-flexible substrate disposed adjacent to the flexible board;
- an insulating layer comprising an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board;
- a conductive layer formed on the insulating layer and including a conductor pattern;
- and
- a via hole conductor formed in the insulating layer and connecting the conductive layer on the insulating layer and the conductive layer of the flexible board at the plurality of connection portions;
- and
- a second insulating layer covering the flexible board and the non-flexible substrate and exposing the at least one portion of the flexible board,
- wherein the insulating layer covers surfaces of the flexible board and the non-flexible substrate on a first side and the second insulating layer covers surfaces of the flexible board and the non-flexible substrate on a second side opposite to the first side.
A flex-rigid wiring board comprising:
- a flexible board comprising a flexible substrate and a conductive layer formed over the flexible substrate;
- a non-flexible substrate disposed adjacent to the flexible board;
- an insulating layer comprising an inorganic material and covering the flexible board and the non-flexible substrate, the insulating layer exposing at least one portion of the flexible board;
- a conductive layer formed on the insulating layer;
- a via hole conductor formed in the insulating layer and connecting the conductive layer on the insulating layer and the conductive layer of the flexible board, the via hole conductor comprising a plating layer;
- and
- a second insulating layer covering the flexible board and the non-flexible substrate and exposing the at least one portion of the flexible board,
- wherein the flexible board further comprises a cover layer protecting the flexible board, a space between the non-flexible substrate and the cover layer and a periphery of the via hole conductor are filled with a resin material comprising an inorganic material, and the insulating layer covers surfaces of the flexible board and the non-flexible substrate on a first side and the second insulating layer covers surfaces of the flexible board and the non-flexible substrate on a second side opposite to the first side.
Dependencies are inferred from the claim text.