Silicon-based hardmask composition and process of producing semiconductor integrated circuit device using the same

A silicon-based hardmask composition, comprising:

• an organosilane polymer represented by Formula 1:
• {(SiO1.5—Y—SiO1.5)x(R3SiO1.5)y(XSiO1.5)z}(OH)e(OR6)f (1),
• wherein:
• x, y, and z satisfy the relations 0.05≦x≦0.9, 0.05≦y≦0.9, 0≦z≦0.9, and x+y+z=1,
• e and f represent the ratios of the numbers of terminal —OH groups and —OR6 groups bonded to the silicon atoms to the number of 2x+y+z silicon atoms in the organosilane polymer, respectively, and satisfy the relations 0.03≦e≦0.2 and 0.03≦f≦0.25,
• X is a C6-C30 group containing at least one substituted or unsubstituted aromatic ring,
• R3 is a C1-C12 alkyl group,
• Y is a linking group selected from the group of an aromatic ring, a substituted or unsubstituted linear or branched C1-C20 alkylene group, a C1-C20 alkylene group containing at least one aromatic or heterocyclic ring or having at least one urea or isocyanurate group in the backbone, and a C2-C20 hydrocarbon group containing at least one multiple bond, and
• R6 is a C1-C6 alkyl group.