Method of fabricating semiconductor device

A method of fabricating a semiconductor device, comprising:

• providing a film to be processed above a semiconductor substrate;
• providing a positive-type resist on the film to be processed;
• providing a photo-curable resist on the positive-type resist, the photo-curable resist having smaller viscosity than the positive-type resist;
• pressing a main surface of a template onto the photo-curable resist, the main surface of the template having a concavo-convex pattern with a light shield portion provided on a part of a convex portion in the concavo-convex pattern so as to be transmissive at the concave portion;
• irradiating the template with light from a back surface of the template;
• developing the photo-curable resist which is not irradiated with light and the positive-type resist which is irradiated with light, and lifting off the photo-curable resist on the positive-type resist so as to print the concavo-convex pattern of the template on the positive-type resist;
• and
• etching the film to be processed by using the concavo-convex pattern printed on the positive-type resist as a mask.