Solid-state imaging device, method for manufacturing the same, and electronic apparatus

A method for manufacturing a solid-state imaging device, the method comprising:

• forming pixels that receive incident light in a pixel array area of a substrate;
• forming pad electrodes in a peripheral area located around the pixel array area of the substrate;
• forming a carbon-based inorganic film on an upper surface of each of the pad electrodes including a connection surface electrically connected to an external component;
• forming a coated film that covers upper surfaces of the carbon-based inorganic films;
• and
• forming an opening above the connection surface of each of the pad electrodes to expose the connection surface,
• wherein the opening formation includes
• forming a resist pattern on an upper surface of the coated film, the resist pattern having openings corresponding to the connection surfaces and covering portions other than the connection surfaces,
• etching the coated film by using the resist pattern as a mask and the carbon-based inorganic films as etching stopper films to expose the upper surfaces of portions of the carbon-based inorganic films that correspond to the connection surfaces, and
• performing ashing on the resist pattern and the portions of the carbon-based inorganic films that correspond to the connection surfaces to simultaneously remove the resist pattern and the portions of the carbon-based inorganic films that correspond to the connection surfaces.